HP ProLiant ML30 Gen10 User Manual

3.2.4 Electrical grounding requirements
3.3 Rack warnings and cautions
3.4 Server warnings and cautions
3.5 Electrostatic discharge
3.6 POST screen options
4 Hardware options installation
4.1 Hardware option installation guidelines
4.2 Tower to rack conversion kit
4.2.1 Installing the tower-to-rack conversion kit
4.2.2 Preparing the server for rack installation
4.2.3 Installing the rack rails and server tray
4.2.4 Installing the server on the tray
4.3 Installing the PCI fan and air baffle options
4.4 Power supply options
4.4.1 Hot-plug power supply calculations
4.4.2 Power supply warnings and cautions
4.4.3 Flexible Slot (Redundant) power supply enablement option
4.4.3.1 Installing a Flexible Slot (Redundant) power supply enablement option
4.5 Drive options
4.5.1 Drive installation guidelines
4.5.2 Drive support information
4.5.3 Installing an LFF non-hot-plug drive in the drive cage
4.5.4 Installing an LFF hot-plug drive
4.5.5 Installing an SFF hot-plug drive
4.6 Media device options
4.6.1 Installing a SAS LTO tape drive
4.6.2 Installing a USB RDX drive
4.6.3 Installing an optical drive
4.6.4 Installing an LFF non-hot-plug drive in the media drive bay
4.7 Memory options
4.7.1 DIMM population information
4.7.2 Installing a DIMM
4.8 M.2 SSD/dedicated iLO/serial port enablement option
4.8.1 M.2 SSD/dedicated iLO/serial port enablement option components
4.8.2 Installing the M.2 SSD/dedicated iLO/serial port enablement board
4.8.3 Installing the serial port cable
4.8.4 Enabling the dedicated iLO management module
4.9 M.2 SSD option
4.9.1 Installing an M.2 NVMe SSD on the system board
4.9.2 Installing an M.2 NVMe SSD on an M.2 SSD/dedicated iLO/serial port enablement board
4.10 Storage controller options
4.10.1 Installing a Smart Array standup storage controller
4.11 Energy pack options
4.11.1 HPE Smart Storage Battery

HP ProLiant ML30 Gen10 Specifications

General

Bus type	DMI3
Tjunction	100 °C
Scalability	1S
Processor cache	8 MB
Processor model	E-2124
System bus rate	8 GT/s
Processor socket	LGA 1151 (Socket H4)
Processor threads	4
Processor codename	Coffee Lake
Execute Disable Bit	Yes
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor boost frequency	4.3 GHz
Processor operating modes	64-bit
Embedded options available	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	71 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2666 MHz
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
On-board graphics card model	-
Internal memory	8 GB
Maximum internal memory	64 GB
Memory layout (slots x size)	1 x 8 GB
HDD size	- \
Supported HDD sizes	3.5 \
Total storage capacity	0 GB
Maximum storage capacity	- TB
Number of HDDs installed	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	5
Chassis type	Tower (4U)
Product color	Black
Power supply	350 W
Ethernet interface type	Gigabit Ethernet
PCI Express slots version	3.0
Processor ARK ID	134856
Intel Secure Key Technology version	1.00

Weight and Dimensions

Depth	475 mm
Width	175 mm
Height	368.3 mm