D20 I/O Backplane
Before performing the following procedure, read the “Safety Considerations” on
page 53.
I/O Backplane Removal
To remove the I/O backplane from the subsystem, do the following:
1. Open the rack front door.
2. Shut down the system as described in “Stopping the System” on page 55.
3. Put the Model D20 subsystem into the service position.
4. Disconnect the power source from the system.
Note: This system may be equipped with a second power supply. Before
continuing with this procedure, ensure that the power source to the system
has been completely disconnected.
5. Open the service access cover as described in “Opening the Service Access
Cover” on page 127.
6. Disconnect the RIO-G cables from the RIO connectors located on the rear of the
subsystem.
7. Disconnect the power cables from the power supplies
8. Disconnect the SPCN connectors from the back of the subsystem chassis.
9. Label, then disconnect all PCI adapter cables from their respective adapters.
10. Remove the RIO bus adapter as described in “RIO Bus Adapter Removal” on
page 139.
11. Remove all of the power supplies or power supply filler as described in “Power
Supply Removal” on page 169.
12. Remove all PCI adapters as described in “Non-Hot-Pluggable PCI Adapter
Removal” on page 145.
Note: Alternately remove the PCI dividers as you are removing the PCI adapters.
13. Disconnect the following cables from the connectors located on the front of the I/O
backplane.
v Operator panel cable
v DASD SPCN cable
v DASD Power
v Cooling Blower
14. Remove the three retaining screws that secure the front edge of the I/O backplane
to the subsystem chassis.
15. Go to the back of the subsystem and remove the two retaining screws that secure
the back edge of the I/O backplane to the back of the chassis.
Note: The two retaining screws that secure the back edge of the I/O backplane to
the back of the subsystem chassis are located just below the left SPCN
connector and the rack indicator connector.
16. Remove the plastic membrane from the top of the I/O backplane.
Chapter 8. Removal and Replacement Procedures 175
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