MARTINDALE ET4500 - Page 3

Martindale ET4000 / ET4500 Table of contents
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5.2 Insulation resistance ........................................................................................ 29
5.3 Resistance of earth connection and equipotential bonding ............................. 31
5.3.1 Continuous resistance measurement ....................................................... 33
5.3.2 R LOWΩ, 200 mA resistance measurement ............................................ 34
5.3.3 Continuous low current resistance measurement .................................... 35
5.3.4 Nulling of test lead resistance .................................................................. 37
5.4 Testing RCDs .................................................................................................. 38
5.4.1 Contact voltage (RCD Uc) ........................................................................ 39
5.4.2 Trip-out time (RCDt) ................................................................................. 40
5.4.3 Trip-out current (RCD I) ............................................................................ 40
5.4.4 RCD Autotest ........................................................................................... 42
5.5 Fault loop impedance and prospective fault current ........................................ 44
5.6 Line impedance and prospective short-circuit current / Voltage drop .............. 47
5.6.1 Line impedance and prospective short circuit current .............................. 48
5.6.2 Voltage drop ............................................................................................. 49
5.7 Earth resistance (ET4500 only) ....................................................................... 52
5.7.1 Standard earth resistance measurement ................................................. 53
5.8 PE test touch terminal ..................................................................................... 55
6 Data handling (ET4500 only) ................................................................................ 57
6.1 Memory organization ....................................................................................... 57
6.2 Data structure .................................................................................................. 57
6.3 Saving test results ........................................................................................... 59
6.4 Recalling test results ....................................................................................... 60
6.5 Clearing stored data ........................................................................................ 61
6.5.1 Completely clearing all memory content ................................................... 61
6.5.2 Clearing measurement(s) in selected locations ........................................ 61
6.5.3 Clearing individual measurements ........................................................... 62
6.5.4 Renaming installation structure elements (upload from PC) .................... 63
6.6 Communication ............................................................................................... 64
6.6.1 USB and RS232 communication .............................................................. 64
7 Upgrading the instrument firmware .................................................................... 65
8 Maintenance .......................................................................................................... 66
8.1 Battery replacement ........................................................................................ 66
8.2 Fuse replacement ............................................................................................ 66
8.3 Test lead replacement ..................................................................................... 67
8.4 Cleaning .......................................................................................................... 67
8.5 Periodic calibration .......................................................................................... 67
8.6 Service ............................................................................................................ 67
9 Technical specifications ...................................................................................... 68
9.1 Insulation resistance ........................................................................................ 68
9.2 Continuity ........................................................................................................ 69
9.2.1 Resistance R LOW, R2, R1+R2 ............................................................... 69
9.2.2 Resistance CONTINUITY ......................................................................... 69
9.2.3 RING Continuity ....................................................................................... 69
9.3 RCD testing ..................................................................................................... 70
9.3.1 General data ............................................................................................ 70
9.3.2 Contact voltage RCD Uc .......................................................................... 70