Setup
DIP Switch Configuration (SW1)
EPOS4 Disk 60/8 Hardware Reference
CCMC | 2021-10 | rel10276
3-45
3.5 DIP Switch Configuration (SW1)
Figure 3-31 DIP switch SW1 and solder pads – Location
3.5.1 CAN ID (Node-ID) / DEV ID
The device’s identification (subsequently called “ID”) is set by means of DIP switches 1…4 and, additionally,
by shortening the solder pads JP301 and JP302. The ID (1…63) may be coded using binary code.
Setting the ID by DIP switch SW1 and solder pads JP301, JP 302
• By setting the DIP switch (1…4) address 0 (“OFF”), the ID may be set by software (object 0x2000
«Node-ID», range 1…127).
• The ID results in the summed values of DIP switch addresses 1 (“ON”) and shorted solder pads JP301
and JP 302.
• DIP switches 5 and 6 do not have any impact on the ID.
Table 3-62 DIP switch SW1 – Binary code values
Continued on next page.
Setting Switch Binary Code Valence
(factory setting)*
1
2
0
1
2
2
1
2
3
2
2
4
4
2
3
8
JP301 closed
2
4
16
JP302 closed
2
5
32
* the default setting for the solder pads JP301, JP302 is “open”