Figure 12. Thermal Mounting Solutions Comparison
1. Good—Horizontal mounting with no additional thermal provisions
2. Better—Vertical mounting with an attached heat sink
3. Best—Vertical mounting directly to a thermally-conductive wall or plate
Designing A Thermal Solution
If the Thermal Kit for NI sbRIO-9607/9627/9637 (153901-02) does not satisfy your design
requirements, NI recommends replicating the features of the heat spreader into your own
thermal solution. Use the pedestal dimensions shown in the following figure and a Bergquist
GPVOUS-0.060 thermal gap pad with a fastener assembly rate of 4.23 mm/s (10 in./min.) to
prevent damage to the critical components during assembly. NI recommends that you replicate
each of the pedestals and not just the pedestal for the CPU/FPGA.
NI sbRIO-9607 User Manual | © National Instruments | 15
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