Outline of Operation Procedure Operation Manual
8
Setting the Orientation Flat and Notch Positions on the Microscope: [Wafer alignment]
Position Control
The orientation flat alignment position can be set to either four
different points at intervals of 90 degrees (top, bottom, left and right),
or to none.
The symbols on the operation panel indicate the orientation flat
alignment positions on the vacuum stage.
Change the orientation flat alignment position before starting the
orientation flat alignment operation. (Settings can be changed at any
time.)
9
Setting the Inspection Time: [Inspection Time] Control
The time for holding a wafer in the inspection position can be set
from 0 to 8 seconds (in 1-second steps), or to ∞. (Settings can be
changed at any time.) Even during this period, the loader will proceed
to the next operation when the [Start] button or the [Unload] button is
pressed, or when the vacuum stage is set.
Setting the inspection time to 0 (zero) seconds disables the macro
registration function.
If the inspection time is set to [∞], rotation is temporarily stopped
when the Top Macro inspection has been left for more than one
minute.
The operation is restarted by pressing the [Start] button.
10 Detailed Settings for the Top Macro Inspection: [Top macro spin direction] and
[Topmacro spin speed] Controls
(1) The [Top macro spin direction] control can be set to a wafer
rotation to the left or to the right, or to no rotation during the Top
Macro inspection. (Settings can be changed at any time.)
(2) The [Top macro spin speed] control can be set to a wafer
rotation speed of from 3 to 30 seconds per rotation during the
Top Macro inspection. (Settings can be changed at any time.)
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