Operation Manual Outline of Operation Procedure
3 Top Macro Inspection
1) By tilting the joystick wafer is tilted in surface macro inspection.
The wafer can be tilted to Omni direction. maximum 20 degree
2) The joystick is locked when its lock ring is rotated clockwise.
(Use the lock ring to continue inspection at the same tilt angle.)
・
Forcibly operating a locked joystick will weaken the locking force and make the
joystick unable to hold a fixed position.
・
If the joystick is operated abruptly, a wafer may bump into the arm. Operate the
joystick at 20 degrees per second or slower.
4 Back Macro Inspection and 2nd Back Macro Inspection: Setting the Back Macro Tilt
Angle
1) The Back Macro Tilt Angle setting buttons can be reset in a 360
degree range during inspection.
2) The tilt angle can be changed by using the angle setting buttons
and .
: Back rotation
: Front rotation
3) One tilt position can be registered.
Move the wafer to the desired tilt angle using the Back Macro
Tilt Angle setting buttons, and then press and hold down the
Memory button until the buzzer sounds.
・
Do not
push the bottom of the wafer firmly during the back macro test. It may
cause wafer drops from the L-Arm.
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