Quectel EP06 Series - Page 5

LTE-A Module Series
EP06 Series Hardware Design
EP06_Series_Hardware_Design 4 / 56
6.3. Power Supply Requirements ................................................................................................... 40
6.4. RF Characteristics ................................................................................................................... 40
6.5. Operating and Storage Temperatures .................................................................................... 42
6.6. Electrostatic Discharge ............................................................................................................ 42
6.7. Current Consumption .............................................................................................................. 43
6.8. Thermal Consideration ............................................................................................................ 49
7 Mechanical Dimensions .................................................................................................................... 51
7.1. Mechanical Dimensions ........................................................................................................... 51
7.2. Standard Dimensions of Mini PCI Express ............................................................................. 52
7.3. Top and Bottom Views ............................................................................................................ 53
7.4. Packaging ................................................................................................................................ 54
8 Appendix A References ..................................................................................................................... 55