1. Make sure that customers’ PCB design provides sufficient cooling for the module: proper mounting,
heatsinks, and active cooling may be required depending on the integrated application.
2. In order to protect the components from damage, the thermal design should be maximally optimized
to make sure the module’s internal temperature always maintains below 105°C. Customers can
execute AT+QTEMP command to get the module’s internal temperature.
3. For more detailed guidelines on thermal design, refer to document [5].
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