SONIX SN8P2501D - 13.3 Marking Example

SN8P2501D
8-Bit Micro-Controller
SONiX TECHNOLOGY CO., LTD Page 90 Version 1.5
13.3 MARKING EXAMPLE
 Wafer, Dice:
Name
ROM Type
Device
Package
Temperature
Material
S8P2501DW
OTP
2501D
Wafer
-20℃~85℃
-
SN8P2501DH
OTP
2501D
Dice
-20℃~85℃
-
 Green Package:
Name
ROM Type
Device
Package
Temperature
Material
SN8P2501DPG
OTP
2501D
DIP
-20℃~85℃
Green Package
SN8P2501DSG
OTP
2501D
SOP
-20℃~85℃
Green Package
SN8P2501DXG
OTP
2501D
SSOP
-20℃~85℃
Green Package
SN8P25011DPG
OTP
2501D
DIP
-20℃~85℃
Green Package
SN8P25011DSG
OTP
2501D
SOP
-20℃~85℃
Green Package
 PB-Free Package:
Name
ROM Type
Device
Package
Temperature
Material
SN8P2501DPB
OTP
2501D
DIP
-20℃~85℃
PB-Free Package
SN8P2501DSB
OTP
2501D
SOP
-20℃~85℃
PB-Free Package
SN8P2501DXB
OTP
2501D
SSOP
-20℃~85℃
PB-Free Package
SN8P25011DPB
OTP
2501D
DIP
-20℃~85℃
PB-Free Package
SN8P25011DSB
OTP
2501D
SOP
-20℃~85℃
PB-Free Package
13.4 DATECODE SYSTEM
X X X X XXXXX
Year
Month
1=January
2=February
. . . .
9=September
A=October
B=November
C=December
SONiX Internal Use
Day
1=01
2=02
. . . .
9=09
A=10
B=11
. . . .
03= 2003
04= 2004
05= 2005
06= 2006
. . . .