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Sony CDP-M400CS - 6 Diagrams

Sony CDP-M400CS
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2929
CDP-M400CS
CDP-M400CS
SECTION 6
DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Circuit Boards Location
LED board
MAIN board
IR-IN board
TRANS board
D. MOTOR board
JOG board
BD board
DOOR SW board
T. SENS board
KEYBOARD board
D. SENS
(OUT) board
DISP board
D. SENS (IN) board
LOADING SW board
L. T. MOTOR board
LOCK SW board
For Schematic Diagrams.
Note:
All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
tantalums.
All resistors are in and
1
/
4
W or less unless otherwise
specified.
f : internal component.
C : panel designation.
A : B+ Line.
B : B– Line.
H : adjustment for repair.
•Voltages and waveforms are dc with respect to ground un-
der no-signal (detuned) conditions.
no mark : STOP
•Voltages are taken with a VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
Circled numbers refer to waveforms.
Signal path.
J : CD
c : digital out
•Abbreviation
CND : Canadian model
Note:
The components identi-
fied by mark 0 or dot-
ted line with mark 0 are
critical for safety.
Replace only with part
number specified.
Note:
Les composants identifiés
par une marque 0 sont cri-
tiques pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
For Printed Wiring Boards.
Note:
X : parts extracted from the component side.
Y : parts extracted from the conductor side.
a : Through hole.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
Q
C
These are omitte
d
EB
C
These are omitte
d
EB
– BD Board –
500 mV/DIV, 1
µ
s/DIV
1 V/DIV, 20 ns/DIV
3.8 Vp-p
59 ns
1 IC104 yd XO
2 IC103 qg (RFAC)
1.3 Vp-p
200 mV/DIV, 20 ms/DIV
3 IC101 ra TE
(PLAY)
1.65 V
Approx 500 mVp-p (PLAY)
2.1 Vp-p
7.5
µ
s
200 mV/DIV, 4 ms/DIV
4 IC101 el FE
1 V/DIV, 4
µ
s/DIV
5 IC101 wg MDP
1.65 V
Approx 500 mVp-p (PLAY)
•Waveforms
3.5 Vp-p
62.5 ns
1 V/DIV, 20 ns/DIV
6 IC501 ek X2
– MAIN Board –

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