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ST STEVAL-STWINBX1 - Processing and Connectivity; Table 8. IMP23 ABSU I;O Configuration; Table 9. IMP34 DT05 I;O Configuration

ST STEVAL-STWINBX1
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Table 8. IMP23ABSU I/O configuration
I/O Configuration
PC1 ADC1_IN2
PC0 ADC1_IN1 (REF)
1.6.1.10 IMP34DT05
The IMP34DT05
is an ultra-compact, low-power, omnidirectional, digital MEMS microphone with a capacitive
sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon-
micromachining process dedicated to producing audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide
a digital signal in PDM format.
The IMP34DT05 features low distortion with a 64 dB signal-to-noise ratio and -26 dBFS ±3 dB sensitivity.
The IMP34DT05 is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate
over an extended temperature range from -40°C to +85°C.
Table 9. IMP34DT05I/O configuration
I/O Configuration
PE10 ADF1_SDIO
PE9 ADF1_CCK0
1.6.2 Processing and connectivity
The STWIN.box core system board features several wired and wireless connectivity options and the
STM32U585AI ultra-low-power microcontroller
.
The microcontroller belongs to the STM32U5 series of ultra-low-power MCUs based on the high-performance
Arm
®
Cortex
®
-M33 with TrustZone, which operates at up to 160 MHz and embeds 786 kbytes of SRAM and 2 MB
of dual bank Flash memory.
UM2965
Functional blocks
UM2965 - Rev 1
page 11/58

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