The sensor is housed in a small 2 x 2 x 0.50 mm 6-lead UDFN package with the exposed pad down for a better
temperature match with the surrounding environment.
The STTS22H is factory-calibrated and requires no additional calibration.
The STTS22H units are 100% tested on a production setup that is NIST traceable and verified with equipment
calibrated in accordance with the IA
TF 16949:2016 standard.
Table 2. STTS22H I/O configuration
I/O Configuration
PH4 I2C2_SCL
PF0 I2C2_SDA
PF5 INT
1.6.1.3 TVS912
The TSV91x and TSV91xA operational amplifiers offer low voltage operation and rail-to-rail input and output.
They also of
fer an excellent speed/power consumption ratio, providing an 8 MHz gain-bandwidth product while
consuming only 1.1 mA maximum at 5 V.
The op amps are unity-gain stable and feature an ultra-low input bias current. The devices are ideal for sensor
interfaces, battery-supplied, and portable applications, as well as active filtering.
1.6.1.4 ISM330DHCX
The ISM330DHCX is a system-in-package that features a high-performance 3D digital accelerometer and a 3D
digital gyroscope tailored for Industry 4.0 applications.
The various sensing elements are manufactured using specialized micromachining processes, while the IC
interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed
to match the characteristics of the sensing element.
In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the
same silicon die, guaranteeing superior stability and robustness.
The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of
±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of applications.
All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy
,
stability, extremely low noise, and full data synchronization. The embedded features (Machine Learning Core,
programmable FSM, FIFO, sensor hub, event decoding, and interrupts) enable smart and complex sensor nodes,
which deliver high performance at very low power.
The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.
Table 3. ISM330DHCX I/O configuration
I/O Configuration
PI1 SPI2_CLK
PI3 SPI2_MOSI
PD3 SPI2_MISO
PH15 SPI_CS
PB8 INT1
PF4 INT2
1.6.1.5 IIS3DWB
The IIS3DWB is a system-in package that features a 3-axis digital vibration sensor with low noise over an
ultra-wide and flat frequency range.
The wide bandwidth, low noise, very stable, repeatable sensitivity, and the capability of operating over an
extended temperature range (up to +105°C) make the device particularly suitable for vibration monitoring in
industrial applications.
UM2965
Functional blocks
UM2965 - Rev 1
page 8/58
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