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TMS320C6748
SPRS590G –JUNE 2009–REVISED JANUARY 2017
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Mechanical Packaging and Orderable Information Copyright © 2009–2017, Texas Instruments Incorporated
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 500 mW and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness
and 1.5oz (50um) inner copper thickness
(2) m/s = meters per second
8 Mechanical Packaging and Orderable Information
This section describes the orderable part numbers, packaging options, materials, thermal and mechanical
parameters.
8.1 Thermal Data for ZCE Package
The following table shows the thermal resistance characteristics for the PBGA–ZCE mechanical package.
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]
NO. °C/W
(1)
AIR FLOW (m/s)
(2)
1 RΘ
JC
Junction-to-case 7.6 N/A
2 RΘ
JB
Junction-to-board 11.3 N /A
3 RΘ
JA
Junction-to-free air 23.9 0.00
4
RΘ
JMA
Junction-to-moving air
21.2 0.50
5 20.3 1.00
6 19.5 2.00
7 18.6 4.00
8
Psi
JT
Junction-to-package top
0.2 0.00
9 0.3 0.50
10 0.3 1.00
11 0.4 2.00
12 0.5 4.00
13
Psi
JB
Junction-to-board
11.2 0.00
14 11.1 0.50
15 11.1 1.00
16 11.0 2.00
17 10.9 4.00
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