Hardware Specifications and Configurations 1-31
WWAN Module (3G/LTE) (For C732L & C732LT only)
Card Reader
Item Specifications
Vendor & Model Fibocom L850-GL
Form Factor PCIe M.2
Operating Band
LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 11, 12, 13, 17, 18, 19, 20,
21, 26, 28, 29, 30, 66
LTE TDD: Band 38, 39, 40, 41
WCDMA/HSPA+: Band 1, 2, 4, 5, 8
GNSS/Beidou: support
Data Transmission
LTE FDD: 450 Mbps DL / 50 Mbps UL (Cat 9)
LTE TDD: 260 Mbps DL / 30 Mbps UL (Cat 9)
When LTE TDD achieves maximum DL rate, its UL
rate can reach 10 Mbps only).
UMTS: 384 kbps DL / 384 kbps UL
DC-HSDPA+: 72 Mbps DL (Cat 24) / 5.76 Mbps UL (Cat 6)
Power Supply DC 3.135V-4.4V, typical 3.3V
Antennas Yes. Both AUX and MAIN are routed in the LCD assembly.
Feature
Interface supporting: USIM 3V/1.8V, PCIe 1.0, USB 2.0, USB
3.0 (Base on Linux)
Item Specification
Type MicroSD Card USIM Card
(For C732L & C732LT only)
Chipset Integrated Intel Apollo Lake
SoC
Integrated Fibocom L850
Package Built-in to the CPU Built-in to the LTE Board
Location Left side Right side
Features Supports card formats:
MicroSD
MicroSDHC
Micro SDXC
Built-in USIM card
interface, supporting 1.8V
and 3V SIM cards.
Hot-plugging function