Dell EMC PowerEdge R740 - Page 41

• Do not perform a cold startup below 5°C.
• The operating temperature specied is for a maximum altitude of 3050 m (10,000 ft).
• 150 W/8 core, 165 W/12 core and higher wattage processor [Thermal Design Power (TDP)>165 W] are not supported.
• Redundant power supply unit is required.
• Non-Dell qualied peripheral cards and/or peripheral cards greater than 25 W are not supported.
• PCIe SSD is not supported.
• NVDIMM-Ns are not supported.
• GPU is not supported.
• Tape backup unit is not supported.
Thermal restrictions
Following table lists the conguration required for ecient cooling.
Table 33. Thermal restrictions conguration
Conguration Number of
processors
Heatsink Processor/DIMM
blank
DIMM
blanks
Type of air
shroud
Fan
PowerEdge
R740
1 One 1U standard heat sink for
CPU ≤ 125 W
Required Not
required
Standard Four standard
fans and one
blank to cover
two fan slots
One 2U standard heat sink for
CPU > 125 W
PowerEdge
R740
2 Two 1U standard heat sink for
CPU ≤ 125 W
Not required Not
required
Standard Six standard fans
Two 2U standard heat sink for
CPU > 125 W
PowerEdge
R740 with GPU
2 Two 1U high performance
heat sink
Not required Not
required
GPU air shroud Six high
performance
fans
Ambient temperature limitations
The following table lists congurations that require ambient temperature less than 35°C.
NOTE
: The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess CPU throttling, which may
impact system performance.
Table 34. Conguration based ambient temperature restrictions
System Front backplane CPU Thermal
Design Power
(TDP)
CPU heat sink Fan type GPU Ambient
restriction
PowerEdge
R740
8 x 3.5 inch SAS/
SATA
150 W/8 core, 165
W/12 core, 200
W, 205 W
1U high
performance
High performance
fan
≥1 double-width/
single-width
30°C
8 x 2.5 inch SAS/
SATA
150 W/8 core, 165
W/12 core, 200
W, 205 W
1U high
performance
High performance
fan
≥1 double-width/
single-width
30°C
Technical specications 41