Dell EMC PowerEdge R740 - Particulate and Gaseous Contamination Specifications

System Front backplane CPU Thermal
Design Power
(TDP)
CPU heat sink Fan type GPU Ambient
restriction
16 x 2.5 inch SAS/
SATA
150 W/8 core, 165
W/12 core, 200
W, 205 W
1U high
performance
High performance
fan
≥1 double-width/
single-width
30°C
Particulate and gaseous contamination specications
The following table denes the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If
the levels of particulate or gaseous pollution exceed the specied limitations and result in equipment damage or failure, you may need to
rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 35. Particulate contamination specications
Particulate contamination Specications
Air ltration Data center air ltration as dened by ISO Class 8 per ISO 14644-1 with a
95% upper condence limit.
NOTE: The ISO Class 8 condition applies to data center
environments only. This air ltration requirement does not apply to
IT equipment designed to be used outside a data center, in
environments such as an oce or factory oor.
NOTE: Air entering the data center must have MERV11 or MERV13
ltration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive
particles.
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust
• Air must be free of corrosive dust.
• Residual dust present in the air must have a deliquescent point less than
60% relative humidity.
NOTE: This condition applies to data center and non-data center
environments.
Table 36. Gaseous contamination specications
Gaseous contamination Specications
Copper coupon corrosion rate <300 Å/month per Class G1 as dened by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as dened by ANSI/ISA71.04-2013.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
42 Technical specications