Table 32. Air cooling: Thermal restriction matrix(GPU Configuration) (continued)
Configuration No BP
8 x
2.5-
inch
U.2
16 x
2.5-
inch
SAS
16 x
2.5-
inch
U.2
24 x 2.5-inch SAS
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
U.2
8 x 3.5-
inch
Rear storage
No
Rear
Drives
No
Rear
Drives
No
Rear
Drives
No
Rear
Drive
s
No Rear
Drives
2x
Rear
2.5"
w/ 2x
Rear-
Fan
4x
Rear
2.5 w/
3x
Rear-
Fan
No
Rear
Drives
No Rear
Drives
CPU cTDP
Max
CPU
TDP
Model
+ 1U EXT HSK
9174F
HPR Gold Fan
+ 1U EXT HSK
Memo
ry
16GB RDIMM
HPR Gold Fan
HPR
Gold
Fan
HPR Gold
Fan
32GB RDIMM
64GB RDIMM
GPU
A2
HPR Gold Fan
HPR Gold
Fan **
A16 64GB
HPR Gold
Fan
A30 24GB
A40 48GB
A100 80GB
MI210 64GB
*Note: Supported ambient temperature is 30°C.
**Note: Supported ambient temperature is 35°C.
NOTE: “High-Performance Gold Fan” to be supported on all GPU configs.
NOTE: GPU is not supported on 12 x 3.5-inch configs and system configs with rear module installed.
Table 33. Air cooling: Thermal Guidance (non-GPU)
Configuration No BP
8 x
2.5"
U.2
16 x
2.5"
SAS
16
x
2.5
"
U.2
24 x 2.5" SAS
16 x
2.5"
SAS + 8
x 2.5"
U.2
8 x 3.5-
inch
12 x 3.5-inch
Rear storage
No Rear
Drives
No
Rear
Drives
No
Rear
Drives
No
Re
ar
Dri
ves
No
Re
ar
Dri
ves
2 x
Rea
r
2.5
"w
/ 2
x
Rea
r
fan
4 x
Rear
2.5"
w/ 3
x
Rear
fan
No Rear
Drives
No Rear
Drives
No
Rea
r
Driv
es
2 x
Rea
r
2.5
"
w/
2 x
Rea
r
fan
4 x
Rea
r
2.5
"
w/
3 x
Rea
r
fan
cTDP
Mo
del
Core
Count
Shroud Type Regular Regular Regular
CP
U
240
W
93
34
32 35°C 35°C 35°C 35°C 35°C
Technical specifications 37