ROC800-Series Instruction Manual
Revised July-2017 Input/Output Modules 4-1
Chapter 4 – Input/Output Modules
In This Chapter
4.1 I/O Module Overview .............................................................................. 4-1
4.2 Installation .............................................................................................. 4-4
4.2.1 Removing and Installing Wire Channel Covers .......................... 4-4
4.2.2 Removing and Installing Module Slot Covers ............................. 4-5
4.2.3 Installing an I/O Module .............................................................. 4-5
4.2.4 Removing an I/O Module ............................................................ 4-7
4.2.5 Wiring I/O Modules ..................................................................... 4-7
4.3 Analog Input (AI) Modules...................................................................... 4-7
4.4 Analog Output (AO) Modules ................................................................. 4-9
4.5 Discrete Input (DI) Modules ................................................................. 4-10
4.6 Pulse Input (PI) Modules ...................................................................... 4-12
4.7 Discrete Output (DO) Modules ............................................................. 4-13
4.8 Discrete Output Relay (DOR) Modules ................................................ 4-15
4.9 Resistance Temperature Detector (RTD) Input Modules .................... 4-16
4.10 Advanced Pulse Module (APM) ........................................................... 4-18
4.11 Multi-Variable Sensor Input/Output (MVS I/O) ..................................... 4-21
4.12 Alternating Current Input/Output (AC I/O) Module ............................... 4-26
4.13 Thermocouple (TC) Input Module ........................................................ 4-28
4.14 Highway Addressable Remote Transducer (HART
®
) Module ............. 4-32
4.15 IEC 62591 Module ............................................................................... 4-34
4.16 APP 485 Module .................................................................................. 4-36
4.17 Additional Technical Information .......................................................... 4-37
This chapter describes the Input/Output (I/O) modules used with the
ROC800 and expansion backplanes and contains information on
installing, wiring, and removing those modules.
4.1 I/O Module Overview
The I/O modules typically consist of a terminal block for field wiring
and connectors to the backplane. Each I/O module uses a removable
terminal block to electrically connect to field wiring. Refer to Figures
4-1 and 4-2.
Note: Figure 4-2 represents a ROC827 with one EXP.