Fujitsu PRIMERGY RX200 S6 Service Supplement

18 Service Supplement RX200 S6
Safety instructions
V CAUTION!
● Install the screw removed during installation/detaching Internal
Options in former device/position. To use a screw of the different kind
causes a breakdown of equipment.
● The installation indicated on this note is sometimes changed to the
kind of possible options without notice.
Batteries
V CAUTION!
● Incorrect replacement of batteries may lead to a risk of explosion. The
batteries may only be replaced with identical batteries or with a type
recommended by the manufacturer (see the technical manual for the
system board).
● Do not throw batteries into the trash can. They must be disposed of
in accordance with local regulations concerning special waste.
● The battery must be disposed of in accordance with local regulations
concerning special waste.
● Replace the lithium battery on the system board in accordance with
the instructions in the technical manual for the system board.
● All batteries containing pollutants are marked with a symbol (a
crossed-out garbage can). In addition, the marking is provided with
the chemical symbol of the heavy metal decisive for the classification
as a pollutant:
Cd Cadmium
Hg Mercury
Pb Lead

Fujitsu PRIMERGY RX200 S6 Specifications

General

Tcase	77.6 °C
Bus type	QPI
Stepping	B1
FSB Parity	No
Processor code	SLBV4
Processor cache	12 MB
Processor cores	4
Processor model	E5620
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5600 Series
Processor socket	Socket B (LGA 1366)
Processor threads	8
Processor codename	Westmere EP
Motherboard chipset	Intel® 5500
Number of QPI links	2
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor package size	42.5 X 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.66 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	40 bit
Memory types supported by processor	DDR3 800/1066
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	288 GB
HDD size	2.5 \
RAID levels	1, 5, 6
HDD capacity	146 GB
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	-
Total storage capacity	292 GB
Memory slots	12
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	192 GB
Maximum graphics card memory	32 MB
LAN controller	Intel® 82575EB
USB 2.0 ports quantity	7
Ethernet LAN (RJ-45) ports	3
Drive bays	8 x 2.5 \
Size (imperial)	19 \
Dimensions (WxDxH)	482.6 x 765 x 43 mm
Motherboard manufacturer	D 3031
Recommended humidity operating range	10 - 85 %
Recommended operating temperature range (T-T)	10 - 35 °C
Power supply type	47 - 63 Hz
Power requirements	100 - 127 V / 200 - 240 V
Power consumption (typical)	770 W
Power supply input frequency	50 Hz
Compatible operating systems	Microsoft Windows Server 2008 Microsoft Windows Server 2008 R2 (Hyper-V) Under Hyper-V are (et al): - Windows Server 2008 R2 - Windows Server 2008 - Windows Server 2003 - Windows Server 2000 Microsoft Windows Server 2003 R2 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux Citrix XenServer VMware Infrastructure VMware vSphere 4.0
Management platform	iRMC S2
Chassis type	Rack (1U)
Certification	ISO 7779; ISO 9296
Processor ARK ID	47925
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	17000 g