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Fujitsu PRIMERGY RX200 S6 Service Supplement

Fujitsu PRIMERGY RX200 S6
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RX200 S6 Service Supplement 19
Safety instructions
Working with CDs/DVDs/BDs and optical drives
When working with devices with optical drives, these instructions must be
followed.
V CAUTION!
Only use CDs/DVDs/BDs that are in perfect condition, in order to
prevent data loss, equipment damage and injury.
Check each CD/DVD/BD for damage, cracks, breakages etc. before
inserting it in the drive.
Note that any additional labels applied may change the mechanical
properties of a CD/DVD/BD and cause imbalance.
Damaged and imbalanced CDs/DVDs/BDs can break at high drive
speeds (data loss).
Under certain circumstances, sharp CD/DVD/BD fragments can
pierce the cover of the optical drive (equipment damage) and can fly
out of the device (danger of injury, particularly to uncovered body
parts such as the face or neck).
High humidity and airborne dust levels are to be avoided. Electric
shocks and/or server failures may be caused by liquids such as water,
or metallic items, such as paper clips, entering a drive.
Shocks and vibrations are also to be avoided.
Do not insert any objects other than the specified CDs/DVDs/BDs.
Do not pull on, press hard, or otherwise handle the CD/DVD/BD tray
roughly.
Do not disassemble the optical drive.
Before use, clean the optical disk tray using a soft, dry cloth.
As a precaution, remove disks from the optical drive when the drive
is not to be used for a long time. Keep the optical disk tray closed to
prevent foreign matter, such as dust, from entering the optical drive.
Hold CDs/DVDs/BDs by their edges to avoid contact with the disk
surface.

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Fujitsu PRIMERGY RX200 S6 Specifications

General IconGeneral
Tcase77.6 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBV4
Processor cache12 MB
Processor cores4
Processor modelE5620
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads8
Processor codenameWestmere EP
Motherboard chipsetIntel® 5500
Number of QPI links2
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus- MHz
Processor boost frequency2.66 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Number of processors installed1
CPU multiplier (bus/core ratio)18
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066
Memory channels supported by processorTriple
Memory clock speeds supported by processor800, 1066 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels1, 5, 6
HDD capacity146 GB
HDD interfaceSerial Attached SCSI (SAS)
Optical drive type-
Total storage capacity292 GB
Memory slots12
Internal memory4 GB
Memory clock speed1066 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Maximum graphics card memory32 MB
LAN controllerIntel® 82575EB
USB 2.0 ports quantity7
Ethernet LAN (RJ-45) ports3
Drive bays8 x 2.5 \
Size (imperial)19 \
Dimensions (WxDxH)482.6 x 765 x 43 mm
Motherboard manufacturerD 3031
Recommended humidity operating range10 - 85 %
Recommended operating temperature range (T-T)10 - 35 °C
Power supply type47 - 63 Hz
Power requirements100 - 127 V / 200 - 240 V
Power consumption (typical)770 W
Power supply input frequency50 Hz
Compatible operating systemsMicrosoft Windows Server 2008 Microsoft Windows Server 2008 R2 (Hyper-V) Under Hyper-V are (et al): - Windows Server 2008 R2 - Windows Server 2008 - Windows Server 2003 - Windows Server 2000 Microsoft Windows Server 2003 R2 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux Citrix XenServer VMware Infrastructure VMware vSphere 4.0
Management platformiRMC S2
Chassis typeRack (1U)
CertificationISO 7779; ISO 9296
Processor ARK ID47925
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Weight17000 g

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