Fujitsu PRIMERGY RX200 S6 Service Supplement

42 Service Supplement RX200 S6
Replacement routines
Installing the new system board
Ê Insert the system board by holding it at a slight angle.
Ê Carefully shift the system board to the rear of the server until the connectors
engage with the cut-outs in the connector panel.
Ê Lower the system board carefully into the housing.
Ê Adjust the system board. If necessary adjust the position of the system
board with a gentle twisting motion.
I When the system board is in the right position, the centre rings (see
red circles in figure 20) engage with the holes indicated.
Ê Fasten the system board with the seven screws (see blue circles in
figure 20).
Ê Reinstall the spacer screw (see figure 18).
Ê Reinstall the fan box and fasten it with the two screws (see circles in
figure 19).
Ê Reinstall all fan units (description see the Operating Manual).
Ê Reconnect all cables to the system board (see the cabling plans in the
Appendix of the Options Guide).
Ê If available, reinstall the TPM (see the section "Replacing the TPM" on
page 30).
Ê If available, reinstall the UFM (see the section "Replacing the UFM" on
page 32).
Ê Reinstall the riser card holders (see the Options Guide).
Ê Reinstall the CPU heat sinks (see the Options Guide).
Ê Reinstall the memory modules (see the Options Guide).
Ê Reinstall the air duct (see the section "Installing the air duct" on page 26).
Ê Close the server and connect all power plugs (for a detailed description see
the Options Guide).
Ê Reconnect all external cables.

Fujitsu PRIMERGY RX200 S6 Specifications

General

Tcase	77.6 °C
Bus type	QPI
Stepping	B1
FSB Parity	No
Processor code	SLBV4
Processor cache	12 MB
Processor cores	4
Processor model	E5620
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5600 Series
Processor socket	Socket B (LGA 1366)
Processor threads	8
Processor codename	Westmere EP
Motherboard chipset	Intel® 5500
Number of QPI links	2
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor package size	42.5 X 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.66 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	40 bit
Memory types supported by processor	DDR3 800/1066
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	288 GB
HDD size	2.5 \
RAID levels	1, 5, 6
HDD capacity	146 GB
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	-
Total storage capacity	292 GB
Memory slots	12
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	192 GB
Maximum graphics card memory	32 MB
LAN controller	Intel® 82575EB
USB 2.0 ports quantity	7
Ethernet LAN (RJ-45) ports	3
Drive bays	8 x 2.5 \
Size (imperial)	19 \
Dimensions (WxDxH)	482.6 x 765 x 43 mm
Motherboard manufacturer	D 3031
Recommended humidity operating range	10 - 85 %
Recommended operating temperature range (T-T)	10 - 35 °C
Power supply type	47 - 63 Hz
Power requirements	100 - 127 V / 200 - 240 V
Power consumption (typical)	770 W
Power supply input frequency	50 Hz
Compatible operating systems	Microsoft Windows Server 2008 Microsoft Windows Server 2008 R2 (Hyper-V) Under Hyper-V are (et al): - Windows Server 2008 R2 - Windows Server 2008 - Windows Server 2003 - Windows Server 2000 Microsoft Windows Server 2003 R2 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux Citrix XenServer VMware Infrastructure VMware vSphere 4.0
Management platform	iRMC S2
Chassis type	Rack (1U)
Certification	ISO 7779; ISO 9296
Processor ARK ID	47925
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	17000 g