228 Chapter4
Replaceable Parts
Firmware-Dependent Part Numbers
Table 4-2 Abbreviations
ABBREVIATIONS
A C CONT Contact,
Continuous,
A Across Flats,
Acrylic,
C Capacitance, Control,
Air (Dry
Method),
Capacitor, Controller
Ampere Center Tapped, CONV Converter
ADJ Adjust,
Adjustment
Cermet, Cold, CPRSN Compression
ANSI American
National
Compression CUP-PT Cup Point
Standards
Institute
CCP Carbon
Composition
CW Clockwise,
(formerly Plastic Continuous
Wave
USASI-ASA) CD Cadmium,
Card,
D
ASSY Assembly Cord
AWG American
Wire Gage
CER Ceramic D Deep,
Depletion,
CHAM Chamfer Depth,
Diameter,
B CHAR Character, Direct
Current
BCD Binary Coded Characteristic, DA Darlington
Decimal Charcoal DAP-GL Diallyl
Phthalate
BD Board,
Bundle
CMOS
Complementary
Glass
BE-CU Beryllium
Copper
Metal Oxide DBL Double
BNC Type of
Connector
Semiconductor DCDR Decoder
BRG Bearing,
Boring
CNDCT Conducting, DEG Degree
BRS Brass Conductive, D-HOL
E
D-Shaped
Hole
BSC Basic Conductivity, DIA Diameter
BTN Button Conductor DIP Dual In-Line
Package
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