HP Elite Slice G2 Service Manual

Removing modules
CAUTION: Before disconnecting modules, turn o the Elite Slice G2 and disconnect it from any AC power
source.
Modules cannot be “hot-plugged” or “hot-swapped.”
Modules must be removed one at a time, starting at the bottom. Removing the Base Module exposes the
release latch of the module above it.
1. Remove/disengage the security cable, if one is attached.
2. Remove all removable media, such as USB ash drives.
3. Turn o the Elite Slice G2 properly through the operating system, and then turn o any external devices.
4. Disconnect the AC power cord from the Elite Slice G2 and disconnect any external devices.
5. If the VESA plate is connected, slide the quick release latch on the back of the VESA plate to the unlocked
position and lift the module stack o the VESA plate.
6. Beginning at the bottom, remove additional modules by pressing the release latch (1) on the underside
of each module until it releases the module (2) above it.
8 Chapter 1 Product features

HP Elite Slice G2 Specifications

General

Bus type	DMI3
Processor cache	6 MB
Processor model	i5-7500T
Processor threads	4
Processor frequency	2.7 GHz
Processor cache type	L3
Processor manufacturer	Intel
Processor boost frequency	3.3 GHz
Number of processors installed	1
Configurable TDP-down frequency	1.7 GHz
ECC	No
Internal memory	8 GB
Memory clock speed	2400 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	2 x 4 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD form factor	M.2
Total storage capacity	128 GB
Intel Identity Protection Technology version	1.00
Sustainability certificates	ENERGY STAR
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 630
Maximum on-board graphics card memory	64 GB
Antenna type	2x2
Bluetooth version	4.2
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
WLAN controller model	Intel Dual Band Wireless-AC 8260
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
Chassis type	USFF
Product color	Black
Country of origin	China
Audio chip	Conexant CX7501
Product type	PC
Motherboard chipset	Intel® Q170
Operating system installed	Windows 10 IoT Enterprise
HP segment	Business
Power supply	90 W

Weight and Dimensions

Width	165 mm
Height	112 mm
Weight	1520 g
Package depth	596 mm
Package width	203 mm
Package height	273 mm
Package weight	6670 g