HP ProLiant MicroServer Gen8 Maintenance And Service Guide

Component identification 74
FBWC module LED definitions
The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the
reverse side of the cache module to facilitate status viewing.
1 - Amber 2 - Green 3 - Green Interpretation
Off
Off Off The cache module is not powered.
Off
Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its
boot loader and receiving new flash code from the host
controller.
Off
Flashing 1 Hz Flashing 1 Hz The cache module is powering up, and the capacitor
pack is charging.
Off
Off Flashing 1 Hz The cache module is idle, and the capacitor pack is
charging.
Off
Off On The cache module is idle, and the capacitor pack is
charged.
Off
On On The cache module is idle, the capacitor pack is charged,
and the cache contains data that has not yet been
written to the drives.
Off
Flashing 1 Hz Off A backup is in progress.
Off
On Off The current backup is complete with no errors.
Flashing 1 Hz
Flashing 1 Hz Off The current backup failed, and data has been lost.
Flashing 1 Hz
Flashing 1 Hz On A power error occurred during the previous or current
boot. Data may be corrupt.
Flashing 1 Hz
On Off An overtemperature condition exists.
Flashing 2 Hz
Flashing 2 Hz Off The capacitor pack is not attached.
Flashing 2 Hz
Flashing 2 Hz On The capacitor has been charging for 10 minutes, but
has not reached sufficient charge to perform a full
backup.
On
On Off The current backup is complete, but power fluctuations
occurred during the backup.
On
On On The cache module microcontroller has failed.

HP ProLiant MicroServer Gen8 Specifications

General

Tcase	65.3 °C
Bus type	DMI
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	i3-3240
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3200 Desktop Series
Processor threads	4
Processor codename	Ivy Bridge
Motherboard chipset	Intel® C204
Processor frequency	3.4 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal Design Power (TDP)	55 W
Supported processor sockets	LGA 1155 (Socket H2)
Number of processors installed	1
Thermal solution specification	PCG 2011C
CPU multiplier (bus/core ratio)	34
Thermal Monitoring Technologies	Yes
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
RAID levels	0, 1, 10
HDD interface	Serial ATA
Optical drive type	DVD±RW
Total storage capacity	1000 GB
Maximum storage capacity	12 TB
Memory slots	2x DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 4 GB
On-board graphics card ID	0x152
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
Power supply	200 W
Chassis type	Ultra Micro Tower
Serial ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version	2.0
Operating system installed	-
Compatible operating systems	Microsoft Windows Server Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware
Processor ARK ID	65690
Intel Secure Key Technology version	0.00
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	245 mm
Width	230 mm
Height	232.4 mm
Weight	9800 g