HP ProLiant MicroServer Gen8 Maintenance And Service Guide

Specifications 81
Specifications
Environmental specifications
Specification Value
Temperature range*
Operating
10
°
C to 35
°
C (50
°
F to 95
°
F)
Non-operating
-30°C to 60°C (-22°F to 140°F)
Relative humidity
(non-condensing)
Operating, maximum wet bulb
temperature of 28°C (82.4°F)
10% to 90%
Non-operating, maximum wet
bulb temperature of 38.7°C
(101.7°F)
5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048
m (10,000 ft) is applicable. No direct sunlight allowed.
Server specifications
Specification Server
Height
23.25 cm (9.15 in)
Depth
24.50 cm (9.65 in)
Width
23.00 cm (9.06 in)
Weight, minimum
(one drive, power supply, and
processor installed)
7.40 kg (16.31 lb)
Weight, maximum
(all drives, power supply, and
processor installed)
9.80 kg (21.60 lb)
Power supply specifications
Depending on the installed options and/or the regional location where the server was purchased, the server
is configured with one of the following power supplies:
• HP 150 W Integrated Power Supply (non-hot-plug, non-redundant) ("HP 150 W Integrated Power
Supply specifications" on page 82)
• HP 200 W Integrated Power Supply (non-hot-plug, non-redundant) ("HP 200 W Integrated Power
Supply specifications" on page 82)

HP ProLiant MicroServer Gen8 Specifications

General

Tcase	65.3 °C
Bus type	DMI
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	i3-3240
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3200 Desktop Series
Processor threads	4
Processor codename	Ivy Bridge
Motherboard chipset	Intel® C204
Processor frequency	3.4 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal Design Power (TDP)	55 W
Supported processor sockets	LGA 1155 (Socket H2)
Number of processors installed	1
Thermal solution specification	PCG 2011C
CPU multiplier (bus/core ratio)	34
Thermal Monitoring Technologies	Yes
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
RAID levels	0, 1, 10
HDD interface	Serial ATA
Optical drive type	DVD±RW
Total storage capacity	1000 GB
Maximum storage capacity	12 TB
Memory slots	2x DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 4 GB
On-board graphics card ID	0x152
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
Power supply	200 W
Chassis type	Ultra Micro Tower
Serial ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version	2.0
Operating system installed	-
Compatible operating systems	Microsoft Windows Server Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware
Processor ARK ID	65690
Intel Secure Key Technology version	0.00
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	245 mm
Width	230 mm
Height	232.4 mm
Weight	9800 g