Intelligent Motion Systems IB Series - Table 2.5.1 IB1010 Electrical Specifications; Table 2.5.2 IB1010 Thermal Specifications

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Electrical Specifications
Table 2.5.1: IB1010 Electrical Specifications
Table 2.5.2: IB1010 Thermal Specifications
Thermal Specifications
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erutarepmeTtneibmAC°05+ot0
erutarepmeTegarotS C°521+ot04-
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A
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I
i
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R
SD
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D
A11-= 711.0 smhO
R
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A51=50.077.0smhO
B
RV
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5 V
V
F
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F
Am6.1=5.157.1V
I
F
tnerruCdrawroFtupnI 5 5.7 51 Am
T
KLC
htdiWesluPkcolCpetS3Su
T
S
emiTpu-teS F/H&WCC/WC 2 Su
T
H
emiTdloHF/H&WCC/WC5.5Su
F
C
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.%01+
NOTE: Additional cooling may be required to limit case
temperature to 70°C. An optional heat sink, IMS PN H-100,
is available. See Appendix B: Cooling Solutions, for details.
WARNING! The Driver must be mounted to a thermally
conductive surface such as a metal enclosure wall or a
Heat Sink. The Driver must not be operated when resting on
an insulated surface such as wood or acrylic.