EasyManua.ls Logo

Intelligent Motion Systems IB Series - Appendix B: Cooling Solutions; Figure B.2 H-100 X Heat Sink; Thermal Pads

Default Icon
81 pages
Print Icon
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
68
0.317
(8.05)
0.063
(1.60)
0.250
(6.35)
1.317 ±0.015
(33.45 ±0.38)
2.957
(75.10)
2.00
(50.08)
7.012
(178.10)
2.504
(63.60)
2.626
(66.70)
4.132 ±0.015
(104.95 ±0.38)
0.757
(19.23)
5.497
(139.6)
0.814
(1.95)
0.753
(19.13)
8-32 threaded hole
4 places marked “B”
B
B
B
B
6-32 threaded hole
4 places marked “A”
A
A
A
A
Mechanical Specifications
Figure B.2: H-100 Heat Sink, Dimensions in Inches (mm)
Thermal Pads
IMS has available a series of non-isolating and isolating thermal pads
designed for use with the IB series of half/full step drivers.
Thermal Non-Isolating (TN)
The TN thermal non-isolating pad is a composite of .0015” (.038 mm)
aluminum foil coated on both sides with a .0025” (.063 mm) thick
thermally and electrically conductive rubber. These pads have a thermal
conductivity of 0.65 W/m-K and a maximum temperature rating of
180°C.
One side of the TN pad is adhesive and may be applied directly to the IB
driver. The TN pad eliminates the problems associated with using thermal
grease. The following pads are available for the IB series drives:
TN-462 .............................................................................................IB462
TN-463 .............................................................................................IB463
TN-100 ............................................................ IB104, IB106 & IB1010
These pads are also included in the heat sink kit.

Table of Contents