Microchip Technology SAM Series User Manual

• High-frequency bypass caps located as close to the device power pins as possible.
•
BULK caps located close to the device, but in the case of multiple power pin groups that share the same
PCB power bus, distributed evenly around device perimeter in close proximity to target power pin pair groups.
For example, in some SAM families, VDDIOA and VDDIOB, call for separate 10 µf caps, but most designs
are connected together to the same PCB power bus. Do not connect both BULK caps side by side, instead
distribute and center near the individual VDDIOA and VDDIOB groups.
• All component leads to any power plane or ground plane must be as short as possible. The best solutions
are plane connection vias inside the surface mount pads. When using vias outside the surface mount pads,
pad-to-via connections must be less than 5-10 mils in length. Trace connections must be as wide as possible to
lower inductance. This will include any power ferrite beads feeding power planes, fuses feeding power planes,
and so on.
Figure 7-3. PIC32MX/PIC32MM/PIC32MZ/PIC32MK Recommended Minimum CPU Power Bypassing
10µf
* (2) VCORE
4.7µf
VSS
VDD
VSS
VUSB3V3
VSS
VDD
VSS
VDD
VDD
VSS VSS
VDD
VSS
VDD
VSS VDD
AVDD AVSS
PIC32
MX/MM/MK/MZ
XTAL
0.01uf
0.1uf 0.1uf
0.01uf
0.1uf
0.01uf
0.1uf
0.01uf
0.1uf
0.01uf
0.1uf
0.01uf
0.1uf
0.01uf
0.1uf
0.01uf
0.1uf
0.01uf
10µf
* (1) VCAP
VDD
1. VCAP Pin only present on PIC32MX/PIC32MM family.
2. VCORE & VDDR1V8 Pin only present on PIC32MZxxDAxx
family.
3. If External +VREF utilized.
*(2) VDDR1V8
0.1uf
0.01uf
0.1uf
0.01uf
10µf
0.1uf
+VREF
*(3) +VREF
MI0805J102R-10
MI0805J102R-10
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MCU Start-up Problems
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echnology Inc.
and its subsidiaries
Manual
DS70005439B-page 14

Microchip Technology SAM Series Specifications

General

Brand	Microchip Technology
Model	SAM Series
Category	Microcontrollers
Language	English