Product Principle 4-5
 The system can communicate with the transmission board via the communication control
bus.
4.2.4 Receiving Board
The main structure of the receiving board is shown as the figure below, which consists of
high-voltage isolation, ultrasonic receiving, beam former, etc.
Function:
 High-voltage isolation;
 LNA, VCA/PGA, LPF, ADC, which are performed by the integrated front-end chip;
ATGC module, voltage gain control module;
 Beam former, performed by FPGA;
 Clock module, the clock source of the whole front-end unit is on the receiving board, clock
buffer is sent to the corresponding board via communication mother board.
 Power module, receiving the power from the communication mother board and transferring it
into power required by receiving board
 Configuration module, configure the FPGA on the board.
Front-end analog motherboard
ATGC
High-voltage
isolation
AFE chip
Board-to-board connect socket
Board-to-board
connect socket
cable connection
Digital echo
Control signal
A+12V/A+19V/A+5V7/A-
5V7/A+4V2/A+3V3/A+2V5/A+1V8
Clock
Receiving board
AFE chip
Beamformer
FPGA 1
Communication motherboard
High-voltage
isolation
Beamformer
FPGA 2
Clock
circuit
DDR2
Fig 4-6 Schematic Diagram of Receiving Board
4.2.5 Signal Processing Board
The signal processing board can be divided into two kinds: one kind can support 4D and
elastography, while the other one doesn’t support 4D and elastography. When 4D/TEE board is
selected, the corresponding signal process board should be used.
The hardware structures of the two boards are shown as follows:
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