Pilz GmbH & Co. KG, Felix-Wankel-Straße 2, 73760 Ostfildern, Germany
Telephone: +49 711 3409-0, Telefax: +49 711 3409-133, E-Mail: pilz.gmbh@pilz.de
6-5
6.3 Preparing for operation
6 Commissioning
6.3Preparing for operation6300Preparing for operation6-
6.3.1 Function test during commissioning
Function test during commissioning6-Verdrahtung_multi_Basis_Betr_Funktionstest_BA
6.3.2 Commissioning the PNOZmulti safety system for the first time
Commissioning the PNOZmulti safety system for the first time6-Verdrahtung_multi_Basis_Betr_erstes_Mal_BA
Procedure:
` Wire the inputs and outputs on the base unit and expansion modules
in accordance with the circuit diagram.
` Cascading output as auxiliary output: Connect the load to CO+ and
A2, see connection example.
` Connect the supply voltage:
– Supply voltage for the units (connector X7):
– Terminal A1: + 24 VDC
–Terminal A2: 0 V
– Supply voltage for the semiconductor outputs (connector X2):
– Terminal 24 V: + 24 VDC
– 0V terminal: 0 V
Note: Supply voltage must always be applied to X2 and X7, even if you
are not using the semiconductor outputs.
6.3.2.1 Load project from chip card
Load project from chip card6-Verdrahtung_multi_Basis_Betr_erstes_Mal_von_Chipkarte_BA_alt
Procedure:
` Insert the chip card containing the current project into the card slot on
the base unit.
` Switch on the supply voltage.
CAUTION!
It is essential to check that the safety devices operate correctly
` after the chip card has been exchanged
` after a project has been downloaded
` when the project has been deleted from the base unit's mem-
ory ("Reset Project" menu)
NOTICE
Chip contacting is only guaranteed if the contact surface is
clean and undamaged. The chip's contact surface should there-
fore be protected from contamination, contact and mechanical
impact such as scratches.
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