Quectel FC64E - Page 10

Wi-Fi&Bluetooth Module Series
FC64E_Hardware_Design
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Figure Index
Figure 2 : Pin Assignment (Top View) .........................................................................................................20
Figure 3 : Power Supply Block Diagram ......................................................................................................24
Figure 4 : Turn-on and Turn-off Sequence ..................................................................................................25
Figure 5 : WLAN Application Interface Connection .....................................................................................25
Figure 6 : PCIe Interface Connection .......................................................................................................... 27
Figure 7 : Block Diagram of Bluetooth Application Interface Connection ...................................................28
Figure 8 : Reference Circuit with Translator Chip ....................................................................................... 29
Figure 9 : PCM Interface Connection .......................................................................................................... 30
Figure 10 : Requirements of WLAN_SLP_CLK .......................................................................................... 31
Figure 11 : Reference Circuit for RF Antenna Interfaces ............................................................................33
Figure 12 : Microstrip Design on a 2-layer PCB ..........................................................................................33
Figure 13 : Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 33
Figure 14 : Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 34
Figure 15 : Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 34
Figure 16 : Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................36
Figure 17 : Mechanicals of U.FL-LP Connectors (Unit: mm) ......................................................................36
Figure 18 : Space Factor of Mated Connector (Unit: mm) ..........................................................................37
Figure 19 : Module Top and Side Dimensions (Top and Side View) ..........................................................47
Figure 20 : Module Bottom Dimension (Bottom View) ................................................................................48
Figure 21 : Recommended Footprint (Top View) ........................................................................................49
Figure 22 : Top & Bottom View of FC64E ................................................................................................... 50
Figure 23 : Recommended Reflow Soldering Thermal Profile ................................................................... 52
Figure 24 : Carrier Tape Dimension Drawing ..............................................................................................54
Figure 25 : Plastic Reel Dimension Drawing ...............................................................................................54
Figure 26 : Packaging Process ....................................................................................................................55