Installation and EMC guidelines
1.11 Equipotential bonding
SIMATIC TDC hardware
22 System Manual, 08/2017, A5E01114865-AL
In order to ensure disturbance-free operation, the networked components may not develop
different potentials. For this reason, all components must be interconnected by means of
equipotential bonding with a minimum cross-section of 16 mm
2
.
Principle of the connection
All components (racks, power supplies, etc.) that are connected by signal cables must also
be interconnected by means of equipotential bonding (exception: components with fiber-optic
connections).
An equipotential busbar should be provided in each control cabinet to facilitate wiring.
All internal and external components must be interconnected with this equipotential busbar.
To Next Page
Loading...
