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Siemens SIMATIC CPU 410 User Manual

Siemens SIMATIC CPU 410
434 pages
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SIMATIC
PCS 7 process control system
CPU 410 Process Automation/CPU
410 SMART
System Manual
05/2017
A5E31622160
-AC
Preface
1
Introduction to the CPU 410
2
Configuration of the CPU
410
3
PROFIBUS DP
4
PROFINET IO
5
I/O configuration variants
6
System and operating states
of the CPU 410
7
Link-up and update
8
Special functions of the CPU
410
9
Time synchronization and
time stamping
10
Plant changes in RUN - CiR
11
Plant changes during
redundant operation - H-CiR
12
Replacement of failed
components during
redundant operation
13
Synchronization modules
14
System expansion card
15
Technical data
16
Properties and technical
specifications of CPU 410
SMART
17
Supplementary information
18
Characteristic values of
redundant automation
systems
A
Function and communication
modules that can be used in
a redundant configuration
B
Connection examples for
redundant I/Os
C

Table of Contents

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Siemens SIMATIC CPU 410 Specifications

General IconGeneral
TypeCPU
Communication InterfacesPROFIBUS DP, PROFINET
Power Supply24 V DC
Number of DP masters1
Number of PROFIBUS DP slavesUp to 125
Number of S7 connections32
Operating Temperature0 to 60 °C
I/O PortsConfigurable
Product type designationCPU 410
Digital InputsConfigurable
Digital OutputsConfigurable
Analog InputsDepends on the I/O modules used with the CPU
Analog OutputsDepends on the I/O modules used with the CPU
Number of function blocks (FB)256
Number of functions (FC)256
Number of data blocks (DB)256

Summary

Preface

1.1 Preface

Manual overview, changes from previous versions, and relevant components.

1.2 Security information

Industrial security concepts, product security functions, and recommendations for secure operation.

1.3 Documentation

Overview of user documentation, listing manuals for setup, module data, and system components.

2 Introduction to the CPU 410

2.1 Area of application of the CPU 410 in SIMATIC PCS 7

Purpose of redundant automation systems, fail-tolerant vs. fail-safe, and reasons for fault-tolerance.

2.2 Possible applications

Configuration information, S7-400 hardware components, and examples of S7-400H configurations.

2.3 The CPU 410 basic system for stand-alone operation

Definition of stand-alone operation, hardware components, central controller, expansion units, and power supply.

2.4 The basic system for redundant operation

Operation requirements, hardware, CPUs, racks, power supply, synchronization modules, and fiber-optic cables.

2.5 Rules for H station assembly

Rules for fault-tolerant station assembly, CPU insertion, module requirements, and system expansion cards.

2.6 I/O for the CPU 410

Usage of SIMATIC S7 I/O modules, function modules, and communication modules with CPU 410.

2.7 I/O configuration variants of the fault-tolerant system

Configuration variants for I/O modules: one-sided, single-channel switched, and dual-channel.

2.8 Configuration tools (STEP 7 HW Config, SIMATIC PCS 7)

Configuring CPU 410-5H using STEP 7 HW Config and optional software.

2.9 The SIMATIC PCS 7 project

License management, system expansion card usage, project expansion, and PO expansion by replacing SEC.

3 Configuration of the CPU 410

3.1 Operator controls and indicators on the CPU 410

Arrangement of controls, LED displays for top/bottom bars, interfaces, and reset button.

3.2 CPU 410 monitoring functions

Monitoring functions and error messages, overview of errors, causes, and responses with error LEDs.

3.3 Status and error displays

RUN/STOP LEDs, MSTR/RACK/INTF/EXTF/BUS/IFM/LINK/RX/TX/REDF LEDs, and their states.

3.4 PROFIBUS DP interface (X1)

Connectable devices, connectors, and redundant operation for PROFIBUS DP interface.

3.5 PROFINET IO interfaces (X5, X8)

IP address assignment, connectable devices, connectors, and properties of PROFINET IO interfaces.

3.6 Summary of parameters for CPU 410

Default parameter values, parameter blocks, assignment tool, and further settings for CPU 410.

4 PROFIBUS DP

4.1 CPU 410 as PROFIBUS DP master

Startup of DP master system, PROFIBUS address, and output/input data length.

4.2 Diagnostics of the CPU 410 as PROFIBUS DP master

Diagnostics using LEDs, meaning of BUS1F LED, and diagnostic addresses for DP master.

5 PROFINET IO

5.1 Introduction

What is PROFINET IO, RT communication, and relevant documentation available online.

5.2 PROFINET IO systems

Functions of PROFINET IO, graphic overview of connection paths, and examples of connection paths.

5.3 Device replacement without exchangeable medium / ES

Simple IO device replacement, requirements, and additional information.

6 I/O configuration variants

6.1 Stand-alone operation

Definition, reasons, observations, fault tolerance LEDs, configuration procedure, and expansion to fault-tolerant system.

6.2 Fail-safe operation

Ensuring functional safety, SIMATIC Safety Integrated, fail-safe CPU functions, S7 F/FH Systems, and fail-safe I/O modules.

6.3 Fault-tolerant automation systems (redundancy operation)

Objectives of redundant systems, why fault-tolerant, and redundant I/O.

6.4 Introduction to the I/O link to fault-tolerant system

I/O installation types for fault-tolerant systems (PROFINET IO, PROFIBUS DP).

6.5 Using single-channel switched I/O

Definition, addressing, configuration at PROFIBUS DP interface, and notes on reconfiguration in RUN mode.

6.6 Versions of I/O connection to the PROFINET IO interface

System redundancy configurations for PROFINET IO, logical topology, and S2/R1 devices.

7 System and operating states of the CPU 410

7.1 CPU 410 operating modes

CPU reaction in RUN mode (program execution, I/O access), single mode, link-up, update, and redundant system mode.

7.2 System states of the redundant CPU 410

S7-400H structure, active redundancy meaning, master/standby convention, and master-standby assignment.

7.3 Self-test

Processing the self-test, response to errors during self-test, and causes of hardware faults.

7.4 Performing a memory reset

Memory reset process, LED behavior during reset, and data retained after reset.

8 Link-up and update

8.1 Effects of link-up and updating

Effects of link-up/update on user program execution, communication functions, and REDF LED indication.

8.2 Link-up and update via an ES command

Possible PG commands for link-up/update based on firmware, hardware, and connection conditions.

8.3 Time monitoring

Program execution interruption during updating, monitoring times, and factors influencing cycle time.

8.3.1 Time response

Time response during link-up/update, influencing factors, and determining monitoring times.

8.3.2 Determining the monitoring times

Calculation of monitoring times using STEP 7 or formulas, and monitoring time accuracy.

8.3.3 Performance values for link-up and update

User program share of maximum inhibit time for priority classes > 15 and its calculation.

8.3.4 Influences on time response

Factors influencing time response: data blocks, SFBs, system modifications, and DP/PROFINET expansion.

8.4 Special features in link-up and update operations

Input signal requirements during update, communication links, and memory reset on link-up cancelation.

9 Special functions of the CPU 410

9.1 Security functions of the CPU 410

Automation system protection: signed firmware, protection levels, SysLogEvents, Field Interface Security, and Block Privacy.

9.2 Security levels

Defining protection levels, setting levels in HW Config, and additional aspects of CPU protection.

9.3 Security event logging

CPU 410 security event support, parameter description for saved files, and event overview.

9.4 Field Interface Security

Activating interface protection, features of disable, and configuring security events.

9.5 Access-protected blocks

Using S7-Block Privacy to protect functions and blocks from unauthorized access.

9.6 Retentive load memory

Retentivity of user program, memory requirements, extended runtimes, and S7 block privacy information.

9.7 Type update with interface change in RUN

Overview of type update, caution when replacing CPU, and buffering with battery.

9.8 Resetting the CPU 410 to delivery condition (reset to factory setting)

CPU factory settings, reset procedure, and LED patterns during CPU reset.

9.9 Reset during operation

CPU operating state, reset procedure during operation, and reset in stand-alone operation with restart.

9.10 Response to fault detection

Response to fault detection, automatic reboot for one-sided defects in fault-tolerant systems.

9.11 Reading service data

Procedure for reading and saving service data for customer support, and note on security events.

9.12 Updating firmware in stand-alone operation

Firmware update procedure in stand-alone mode: basic steps, requirements, and two-stage vs. one-stage updates.

9.13 Updating firmware in redundant mode

Firmware update requirements and procedures for redundant mode, including two-stage and one-stage updates.

10 Time synchronization and time stamping

10.1 Definition of time synchronization

Process of S7 stations receiving local time from a central source and time-of-day synchronization requirements.

10.2 Interfaces

Time-of-day synchronization options via PROFINET IO, backplane bus, and PROFIBUS DP interfaces.

10.3 Time-of-day synchronization via the PROFINET IO interface

Time-of-day synchronization using NTP or SIMATIC methods via PROFINET IO.

10.4 CPU 410 as time slave

CPU 410 as time slave on S7-400 backplane bus, synchronization via CP with LAN clock.

10.5 CPU 410 as time master

Configuring CPU 410 as time master, specifying synchronization interval, and setting time as slave.

10.6 Definition of time stamping

Assignment of an event to its acquisition time, IO controller sending time to IO subsystem, and high-precision time stamping.

10.7 Relationship between time synchronization and time stamping

Examining chronological relationships between time-stamped events from different S7 stations.

10.8 Precision

Time stamping precision as the maximum difference of time stamps from simultaneous signal recordings.

10.9 Resolution

Resolution of time stamping as the smallest possible time difference between two time stamps.

11 Plant changes in RUN - CiR

11.1 Motivation for CiR via PROFINET IO

Systems requiring shutdown-free operation, using CiR for configuration changes in RUN, and hardware requirements.

11.2 Permitted changes over PROFINET IO

Permitted changes: adding/removing IO devices, modules, parameters, ports, update time, and process image partition.

11.3 Procedure for PROFINET IO

Basic operating steps in RUN mode: adding/removing IO devices/modules, rebuilding hardware, changing process image partition.

11.4 Re-configuring I/O modules and ports in IO devices

Requirements for reconfiguration: using channels, not changing addresses, CiR capability of devices.

11.5 Motivation for CiR via PROFINET DP

Motivation for CiR via PROFINET DP, hardware requirements for PROFIBUS DP, and software requirements.

11.6 Permitted changes over PROFIBUS DP

Permitted changes for PROFIBUS DP: adding modules, reassigning parameters, replacing modules, adding slaves, changing process image partition.

11.7 CiR objects and CiR modules for PROFINET DP

Available CiR elements: DP master system, PA master system, and modular DP slave.

11.8 Procedure for PROFIBUS DP

Basic steps in STOP state: defining, deleting, editing CiR elements, downloading configuration.

11.9 Reconfigure existing modules in ET200M / ET200iSP stations

Requirements for reconfiguration: using channels, not changing addresses, CiR capability.

11.10 Notes on Reconfiguration in RUN Mode Depending on the I/O

Rules for system modification during runtime for ET 200SP HA modules.

11.11 Effects on the process when re-configuring in RUN

Effects on OS functions during CiR sync: process image update and user program processing.

12 Plant changes during redundant operation - H-CiR

12.1 The H-CiR wizard

H-CiR wizard for plant changes in redundant operation, minimizing risks and avoiding bumps.

12.2 Replacing central components

Modifying central components: CPU parameters, module reconfiguration, and upgrading CPU version.

12.3 Addition of interface modules

Procedure for adding interface modules, de-energized requirements, and wizard steps.

12.4 Motivation for H-CiR via PROFINET IO

Enabling high plant availability via H-CiR in process mode/RUN during redundant operation.

12.5 Permitted changes over PROFINET IO

Permitted changes for PROFINET IO in redundant operation: adding/removing IO systems, controllers, devices, modules, parameters.

12.6 Motivation for H-CiR via PROFIBUS DP

Making plant changes with CPU 410 in redundant mode without interruption, and requirements for switched I/O.

12.7 Permitted changes over PROFIBUS DP

Modifying hardware live, downloading configurations, synchronization link, and replacing distributed I/O components.

12.8 Adding components

Procedure for modifying hardware components, initial situation, and exceptions.

12.9 Removal of components

Procedure for offline hardware modifications related to component removal.

12.10 Editing CPU parameters

Editing CPU parameters in operation, editable parameters, and notes on protected parameters.

12.11 Re-parameterization of a module

Determining reconfigurable modules, PDEV submodule reconfiguration, and notes on protected parameters.

13 Replacement of failed components during redundant operation

13.1 Replacement of central components

CPU replacement situation, system reaction to failure, and requirements for CPU replacement.

13.2 Replacement of components of the distributed I/O on PROFINET IO

IO device replacement situation, system reaction, and procedure for changing an IO device.

13.3 Replacement of components of the distributed I/O on PROFIBUS DP

DP master failure situation, system reaction, and replacement procedure.

14 Synchronization modules

14.1 Synchronization modules for the CPU 410.

Function of synchronization modules, distance between CPUs, types, and usage notes.

14.2 Installation of fiber-optic cables

Fiber-optic cable installation, bending radii, quality assurance, storage, and open installation.

14.3 Selecting fiber-optic cables

Cable pull-in, pressure, heat influence, and selection criteria for fiber-optic cables.

15 System expansion card

15.1 Variants of the system expansion card

Use of SEC, scaling/licensing, and variants for CPU 410-5H and CPU 410E.

16 Technical data

16.1 Technical specifications of CPU 410-5H; (6ES7410-5HX08-0AB0)

General info, product function, engineering, CiR, input current, power loss, memory, backup, CPU processing, blocks, clock sync, interfaces, protocols.

16.2 Technical specifications of CPU 410E (6ES7410-5HM08-0AB0)

General info, product function, engineering, CiR, input current, power loss, memory, backup, CPU processing, blocks, clock sync, interfaces, functionality, PROFINET IO controller services, address area, hardware config.

16.3 Technical specifications of the system expansion card

PCS7 System Expansion Cards PO 0, 100, 500, 1600, 200M: general info, memory, address area, digital/analog channels, standards, hazardous areas, ambient conditions, dimensions, weights.

17 Properties and technical specifications of CPU 410 SMART

17.1 CPU 410 SMART

PO configuration limits, DP master interface, PN/IO controller, and fail-safe operation for CPU 410 SMART.

17.2 Technical specifications of the CPU 410 SMART; (6ES7 410-5HN08-0AB0)

General info, product function, engineering, CiR, input current, power loss, memory, backup, CPU processing, blocks, counters/timers, clock sync, interfaces, functionality, PROFINET IO controller services, address area, hardware config, multicomputing, interface modules, DP masters, IO controllers, media redundancy.

18 Supplementary information

18.1 Supplementary information on PROFIBUS DP

Monitor/Modify via PROFIBUS, bus topology determination, and adding modules to ET 200M/ET200iSP.

18.2 Supplementary information on diagnostics of the CPU 410 as PROFIBUS DP master

Reading diagnostics data with STEP 7, event detection, and evaluating diagnostics data in user program.

18.3 System status lists for PROFINET IO

System status list description, compatibility, and comparison of lists for PROFINET IO and PROFIBUS DP.

18.4 Configuring with STEP 7

Rules for fault-tolerant station arrangement: CPU insertion, DP master interfaces, module identity, layout rules.

18.5 The STEP 7 user program

User program rules for S7-400H, synchronization, and specific blocks for redundancy functions.

18.6 Programming device functions in STEP 7

Display in SIMATIC Manager, communication functions, and their behavior in redundant/single modes.

18.7 Communication services

Table of communication services: PG, OP, S7, routing, PROFIBUS DP, PROFINET IO, SNMP, Open IE.

18.8 Basics and terminology of fault-tolerant communication

Fundamentals and concepts of fault-tolerant communications, including redundant systems and fault-tolerant communication.

18.9 Usable networks

Choice of physical transmission medium based on expansion, fault tolerance, and transfer rate.

18.10 Communication via S7 connections

Availability for communication between fault-tolerant and standard systems using redundant plant bus.

18.11 Communication via fault-tolerant S7 connections

Increasing availability using redundant plant bus (duplex fiber-optic ring, dual electrical bus).

18.12 Consistent data

Processing communication jobs in time slices, data formats, and coordination of shared data access.

18.13 Link-up and update sequence

Objective of link-up: master/standby changeover or achieving redundant system state.

18.14 The user program

User program rules for S7-400H, synchronization, and specific blocks for redundancy functions.

18.15 Other options for connecting redundant I/Os

Redundant I/O at user level, configurations (one-sided, switched), and notes on monitoring times.

18.16 CPU 410 cycle and reaction times

Decisive factors in cycle time, calculation, time slice model, and process image.

A Characteristic values of redundant automation systems

A.1 Basic concepts

Quantitative assessment of redundant systems based on reliability and availability parameters.

A.2 Comparison of MTBF for selected configurations

Comparison of systems with centralized I/Os, framework conditions for calculation, and configurations with redundant CPU 410.

B Function and communication modules that can be used in a redundant configuration

FMs and CPs which can be used centrally

List of function modules (FM) and communication processors (CP) usable centrally with CPU 410-5H.

FMs and CPs usable for distributed switched use

List of function modules (FM) and communication processors (CP) usable for distributed switched use.

C Connection examples for redundant I/Os

C.1 MTA terminal modules (Marshalled Termination Assemblies)

MTA terminal modules for connecting field devices to I/O modules of ET 200M stations.

C.2 Interconnection of output modules

Interconnection of digital output modules with and without external diodes.

C.3 8-channel HART analog input MTA

Connection of encoder to SM 331; AI 8 x 0/4...20mA HART via MTA.

C.4 8-channel HART analog output MTA

Connection of encoder to SM 322; AI 8 x 0/4...20mA HART via MTA.

C.5 SM 321; DI 16 x DC 24 V, 6ES7 321–1BH02–0AA0

Connection of two redundant encoders to SM 321; DI 16 x DC 24 V.

C.6 SM 321; DI 32 x DC 24 V, 6ES7 321–1BL00–0AA0

Connection of two redundant encoder pairs to SM 321; DI 32 x DC 24 V.

C.7 SM 321; DI 16 x AC 120/230V, 6ES7 321–1FH00–0AA0

Connection of two redundant encoders to SM 321; DI 16 x AC 120/230 V.

C.8 SM 321; DI 8 x AC 120/230 V, 6ES7 321–1FF01–0AA0

Connection of two redundant encoders to SM 321; DI 8 x AC 120/230 V.

C.9 SM 321; DI 16 x DC 24V, 6ES7 321–7BH00–0AB0

Connection of two redundant encoder pairs to SM 321; DI 16 x DC 24V.

C.10 SM 321; DI 16 x DC 24V, 6ES7 321–7BH01–0AB0

Connection of two redundant encoder pairs to SM 321; DI 16 x DC 24V.

C.11 SM 326; DO 10 x DC 24V/2A, 6ES7 326–2BF01–0AB0

Connection of an actuator to two SM 326; DO 10 x DC 24V/2A.

C.12 SM 326; DI 8 x NAMUR, 6ES7 326–1RF00–0AB0

Connection of two redundant encoders to SM 326; DI 8 x NAMUR.

C.13 SM 326; DI 24 x DC 24 V, 6ES7 326–1BK00–0AB0

Connection of one encoder to two SM 326; DI 24 x DC 24 V.

C.14 SM 421; DI 32 x UC 120 V, 6ES7 421–1EL00–0AA0

Connection of a redundant encoder to SM 421; DI 32 x UC 120 V.

C.15 SM 421; DI 16 x DC 24 V, 6ES7 421–7BH01–0AB0

Connection of two redundant encoder pairs to SM 421; DI 16 x DC 24 V.

C.16 SM 421; DI 32 x DC 24 V, 6ES7 421–1BL00–0AB0

Connection of two redundant encoders to SM 421; DI 32 x DC 24 V.

C.17 SM 421; DI 32 x DC 24 V, 6ES7 421–1BL01–0AB0

Connection of two redundant encoders to SM 421; DI 32 x DC 24 V.

C.18 SM 322; DO 8 x DC 24 V/2 A, 6ES7 322–1BF01–0AA0

Connection of an actuator to two SM 322; DO 8 x DC 24 V/2 A.

C.19 SM 322; DO 32 x DC 24 V/0,5 A, 6ES7 322–1BL00–0AA0

Connection of an actuator to two SM 322; DO 32 x DC 24 V/0.5 A.

C.20 SM 322; DO 8 x AC 230 V/2 A, 6ES7 322–1FF01–0AA0

Connection of an actuator to two SM 322; DO 8 x AC 230 V/2 A.

C.21 SM 322; DO 4 x DC 24 V/10 mA [EEx ib], 6ES7 322–5SD00–0AB0

Connection of an actuator to two SM 322; DO 16 x DC 24 V/10 mA [EEx ib].

C.22 SM 322; DO 4 x DC 15 V/20 mA [EEx ib], 6ES7 322–5RD00–0AB0

Connection of an actuator to two SM 322; DO 16 x DC 15 V/20 mA [EEx ib].

C.23 SM 322; DO 8 x DC 24 V/0.5 A, 6ES7 322–8BF00–0AB0

Connection of an actuator to two SM 322; DO 8 x DC 24 V/0.5 A.

C.24 SM 322; DO 16 x DC 24 V/0.5 A, 6ES7 322–8BH01–0AB0

Connection of an actuator to two SM 322; DO 16 x DC 24 V/0.5 A.

C.25 SM 332; AO 8 x 12 Bit, 6ES7 332–5HF00–0AB0

Connection of two actuators to SM 332; AO 8 x 12 Bit.

C.26 SM 332; AO 4 x 0/4...20 mA [EEx ib], 6ES7 332–5RD00–0AB0

Connection of an actuator to SM 332; AO 4 x 0/4...20 mA [EEx ib].

C.27 SM 422; DO 16 x AC 120/230 V/2 A, 6ES7 422–1FH00–0AA0

Connection of an actuator to SM 422; DO 16 x AC 120/230 V/2 A.

C.28 SM 422; DO 32 x DC 24 V/0.5 A, 6ES7 422–7BL00–0AB0

Connection of an actuator to SM 422; DO 32 x DC 24 V/0.5 A.

C.29 SM 331; AI 4 x 15 Bit [EEx ib]; 6ES7 331–7RD00–0AB0

Connection of a 2-wire transmitter to SM 331; AI 4 x 15 Bit [EEx ib].

C.30 SM 331; AI 8 x 12 Bit, 6ES7 331–7KF02–0AB0

Connection of a transmitter to SM 331; AI 8 x 12 Bit.

C.31 SM 331; AI 8 x 16 Bit; 6ES7 331–7NF00–0AB0

Connection of a transmitter to SM 331; AI 8 x 16 Bit.

C.32 SM 331; AI 8 x 16 Bit; 6ES7 331–7NF10–0AB0

Connection of a transmitter to SM 331; AI 8 x 16 Bit.

C.33 AI 6xTC 16Bit iso, 6ES7331-7PE10-0AB0

Connection of a thermocouple to SM 331 AI 6xTC 16Bit iso.

C.34 SM331; AI 8 x 0/4...20mA HART, 6ES7 331-7TF01-0AB0

Connection of a 4-wire transmitter to SM 331; AI 8 x 0/4...20mA HART.

C.34 SM331; AI 8 x 0/4...20mA HART, 6ES7 331-7TF01-0AB0

Connection of a 2-wire transmitter to SM 331; AI 8 x 0/4...20mA HART.

C.35 SM 332; AO 4 x 12 Bit; 6ES7 332–5HD01–0AB0

Connection of an actuator to SM 332; AO 4 x 12 Bit.

C.36 SM332; AO 8 x 0/4...20mA HART, 6ES7 332-8TF01-0AB0

Connection of an actuator to SM 332; AO 8 x 0/4...20mA HART.

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