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SIMATIC CPU 410
Siemens SIMATIC CPU 410
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I/O confi
guration
variants
6.3
Fa
ult
-
toler
ant auto
mation s
ystems (
redundancy
operatio
n)
CPU 410 Process Automation/CPU 410 SMART
System Manual
,
05/2017
,
A5E31622160
-
AC
63
No err
or/fau
lt
Figure
6-4
Example of r
edundancy i
n a netw
ork without er
ror
62
64
Table of Contents
Main Page
Default Chapter
3
Table of Contents
3
1 Preface
17
Security Information
20
Documentation
21
2 Introduction to the CPU 410
23
Area of Application of the CPU 410 in SIMATIC PCS 7
23
Figure 2-1 Purpose of Redundant Automation Systems
23
Possible Applications
25
Figure 2-2 Overview
26
The CPU 410 Basic System for Stand-Alone Operation
27
Figure 2-3 Hardware of the S7-400H Basic System
27
The Basic System for Redundant Operation
28
Figure 2-4 Hardware of the S7-400H Basic System
28
Rules for H Station Assembly
30
I/O for the CPU 410
30
I/O Configuration Variants of the Fault-Tolerant System
31
Configuration Tools (STEP 7 HW Config, SIMATIC PCS 7)
31
The SIMATIC PCS 7 Project
31
Scaling and Licensing (Scaling Concept)
32
3 Configuration of the CPU 410
35
Operator Controls and Indicators on the CPU 410
35
Figure 3-1 Arrangement of the Operator Controls and Indicators on the CPU 410
35
Table 3- 1 LED Displays on the Cpus
36
CPU 410 Monitoring Functions
39
Status and Error Displays
41
Table 3- 2 Possible States of the RUN and STOP Leds
41
Table 3- 3 Possible States of the MSTR, RACK0 and RACK1 Leds
42
Table 3- 4 Possible States of the INTF and EXTF Leds
42
Table 3- 5 Possible States of the BUS1F, BUS5F, and BUS8F Leds
42
Table 3- 6 Possible States of the IFM1F and IFM2F Leds
43
Table 3- 7 Possible States of the LINK and RX/TX Leds
43
Table 3- 8 Possible States of the REDF LED
43
Table 3- 9 Possible States of the LINK1 OK and LINK2 OK Leds
44
PROFIBUS DP Interface (X1)
45
PROFINET IO Interfaces (X5, X8)
45
Summary of Parameters for CPU 410
48
4 Profibus Dp
49
CPU 410 as PROFIBUS DP Master
49
Diagnostics of the CPU 410 as PROFIBUS DP Master
49
Table 4- 1 Meaning of the "BUSF" LED of the CPU 410 as DP Master
49
5 Profinet Io
51
Introduction
51
PROFINET IO Systems
52
Device Replacement Without Exchangeable Medium / es
53
6 I/O Configuration Variants
55
Stand-Alone Operation
55
Table 6- 1 System Modifications During Operation
56
Fail-Safe Operation
58
Figure 6-1 Processing Chain: Acquire, Process, Output
58
Figure 6-2 Safety-Related Communication
59
Table 6- 2 Measures in Profisafe for Error Avoidance
60
Fault-Tolerant Automation Systems (Redundancy Operation)
61
Redundant SIMATIC Automation Systems
61
Figure 6-3 Operating Objectives of Redundant Automation Systems
61
Increase of Plant Availability, Reaction to Errors
62
Figure 6-4 Example of Redundancy in a Network Without Error
63
Figure 6-5 Example of Redundancy in a 1-Out-Of-2 System with Error
64
Introduction to the I/O Link to Fault-Tolerant System
65
Figure 6-6 Example of Redundancy in a 1-Out-Of-2 System with Total Failure
65
Using Single-Channel Switched I/O
66
Table 6- 3 Interface Modules for Use of Single-Channel Switched I/O Configuration at the PROFIBUS DP Interface
67
Figure 6-7 Single-Channel Switched Distributed I/O Configuration at the PROFIBUS DP Interface
67
Table 6- 4 Bus Modules for Hot Swapping
68
Figure 6-8 Single-Channel Switched Distributed I/O Configuration at the PROFINET IO Interface
70
Versions of I/O Connection to the PROFINET IO Interface
73
Use of I/O Connected to the PROFINET IO Interface, System Redundancy
73
Figure 6-9 System Redundancy
74
Redundant I/O in an ET 200SP HA
76
Figure 6-10 IO Devices in Multiple Cabinets
76
Figure 6-11 S7-400 H-System with Sensors and Actuators on Module Pairs
78
Figure 6-12 as 410 with Redundant Module Pairs
79
Connection of Two-Channel I/O to the PROFIBUS DP Interface
80
Connecting Redundant I/O
80
Figure 6-13 Redundant I/O in the Switched DP Slave
80
Signal Modules for Redundancy
83
Figure 6-14 Fault-Tolerant Digital Input Module in 1-Out-Of-2 Configuration with One Encoder
89
Figure 6-15 Fault-Tolerant Digital Input Modules in 1-Out-Of-2 Configuration with Two Encoders
90
Figure 6-16 Fault-Tolerant Digital Output Modules in 1-Out-Of-2 Configuration
90
Figure 6-17 Fault-Tolerant Analog Input Modules in 1-Out-Of-2 Configuration with One Encoder
92
Figure 6-18 Fault-Tolerant Analog Input Modules in 1-Out-Of-2 Configuration with Two Encoders
94
Evaluating the Passivation Status
97
Media Redundancy
97
7 System and Operating States of the CPU 410
101
CPU 410 Operating Modes
101
RUN Mode
101
STOP Mode
102
STARTUP Mode
103
HOLD Mode
104
LINK-UP and UPDATE Modes
105
ERROR-SEARCH Mode
105
DEFECTIVE State
106
System States of the Redundant CPU 410
107
Introduction
107
The System States of the Fault-Tolerant System
109
Displaying and Changing the System State of a Fault-Tolerant System
110
System Status Change from the STOP System State
110
System Status Change from the Standalone Mode System Status
111
System Status Change from the Redundant System State
111
System Diagnostics of a Fault-Tolerant System
112
Self-Test
114
Performing a Memory Reset
117
8 Link-Up and Update
119
Effects of Link-Up and Updating
119
Link-Up and Update Via an es Command
120
Time Monitoring
120
Time Response
123
Determining the Monitoring Times
123
Performance Values for Link-Up and Update
130
Influences on Time Response
130
Special Features in Link-Up and Update Operations
131
9 Special Functions of the CPU 410
133
Security Functions of the CPU 410
133
Security Levels
134
Security Event Logging
136
Field Interface Security
139
Access-Protected Blocks
139
Retentive Load Memory
140
Type Update with Interface Change in RUN
141
Resetting the CPU 410 to Delivery Condition (Reset to Factory Setting)
142
Reset During Operation
143
Response to Fault Detection
144
Reading Service Data
145
Updating Firmware in Stand-Alone Operation
146
Updating Firmware in Redundant Mode
148
10 Time Synchronization and Time Stamping
151
11 Plant Changes in RUN - Cir
155
Motivation for Cir Via PROFINET IO
155
Permitted Changes over PROFINET IO
157
Procedure for PROFINET IO
158
Overview
158
Add IO Devices or I/O Modules
159
Rebuild Hardware When Adding an IO Device
160
Change Process Image Partition Assignment
160
Re-Configuring Existing I/O Modules in IO Devices
161
Replacing IO Devices or I/O Modules
161
Re-Configuring I/O Modules and Ports in IO Devices
161
Requirements for Reconfiguration
161
I/O Module Response to Re-Configuration
162
CPU Response During Reconfiguration
162
Reconfiguration Procedure
164
Using a Previously Unused Channel
164
Reconfiguring an Already Used Channel
164
Delete an Already Used Channel
166
Change the Update Time
166
Motivation for Cir Via PROFINET DP
166
Permitted Changes over PROFIBUS DP
168
Cir Objects and Cir Modules for PROFINET DP
170
Basic Requirements
170
Types of Cir Elements
170
Cir Elements and I/O Address Areas
171
Procedure for PROFIBUS DP
172
Basic Procedures in STOP Mode
172
Overview
172
Defining Cir Elements
174
Deleting Cir Elements
176
Basic Procedure in RUN Mode
177
Overview
177
Add Slaves or Modules
178
Reconfigure the Hardware When Adding a Slave
179
Change Process Image Partition Assignment
179
Reconfigure Existing Modules in ET200M / Et200Isp Stations
179
Undo Previous Changes (Undo Function)
180
Replacing Slaves or Modules
180
Using Cir Elements in RUN Mode
181
Undoing Previous Changes
184
Reconfigure Existing Modules in ET200M / Et200Isp Stations
185
Requirements for Reconfiguration
185
Module Response During a Reconfiguration
186
CPU Response During Reconfiguration
186
Reconfiguration Procedure
188
Using a Previously Unused Channel
188
Reconfiguring an Already Used Channel
188
Delete an Already Used Channel
189
Notes on Reconfiguration in RUN Mode Depending on the I/O
190
Modules in IO Devices of the Type ET 200SP HA
190
DP and PA Slaves
190
Modules in ET 200M Modular Slaves
193
Modules in Et200Isp Modular Slaves
194
Effects on the Process When Re-Configuring in RUN
194
Effects on Operating System Functions During the Cir Synchronization Time
194
Behavior of the CPU after Download of the Configuration in RUN
195
Overview
195
Error Displays
196
12 Plant Changes During Redundant Operation - H-Cir
197
The H-Cir Wizard
197
Replacing Central Components
198
Addition of Interface Modules
199
Motivation for H-Cir Via PROFINET IO
201
Permitted Changes over PROFINET IO
202
Motivation for H-Cir Via PROFIBUS DP
204
Permitted Changes over PROFIBUS DP
205
Adding Components
207
Modify Hardware
207
Change Hardware Configuration Offline
208
Opening the H-Cir Wizard
209
Modify and Download the User Program
210
Use of Free Channels on an Existing Module
211
Removal of Components
211
Change Hardware Configuration Offline
212
Modify and Download the User Program
213
Opening the H-Cir Wizard
214
Modify Hardware
215
Removal of Interface Modules
216
Editing CPU Parameters
217
Changing CPU Parameters Offline
219
Opening the H-Cir Wizard
219
Re-Parameterization of a Module
220
Re-Configuring a Module/Pdev Submodule
220
Editing Parameters Offline
221
Opening the H-Cir Wizard
221
13 Replacement of Failed Components During Redundant Operation
223
Replacement of Central Components
223
Replacement of a CPU During Redundant Operation
223
Replacement of a Power Supply Module
225
Replacement of an Input/Output Module or Function Module
226
Replacement of a Communication Module
227
Replacement of Synchronization Module or Fiber-Optic Cable
228
Replacement of an IM 460 and IM 461 Interface Module
231
Replacement of Components of the Distributed I/O on PROFINET IO
231
Replacement of a PROFINET IO Device
231
Replacement of PROFINET IO Cables
232
Replacement of Components of the Distributed I/O on PROFIBUS DP
233
Replacement of a PROFIBUS DP Master
234
Replacement of a Redundant PROFIBUS DP Interface Module
236
Replacement of a PROFIBUS DP Slave
236
Replacement of PROFIBUS DP Cables
237
14 Synchronization Modules
239
Synchronization Modules for the CPU 410
239
Installation of Fiber-Optic Cables
243
Selecting Fiber-Optic Cables
245
15 System Expansion Card
251
Variants of the System Expansion Card
251
16 Technical Data
253
Technical Specifications of CPU 410-5H; (6ES7410-5HX08-0AB0)
253
Technical Specifications of CPU 410E (6ES7410-5HM08-0AB0)
263
Technical Specifications of the System Expansion Card
273
17 Properties and Technical Specifications of CPU 410 SMART
283
Cpu 410 Smart
283
Technical Specifications of the CPU 410 SMART; (6ES7 410-5HN08-0AB0)
285
Technical Specifications of the SEC PO 800
295
18 Supplementary Information
297
Supplementary Information on PROFIBUS DP
297
Supplementary Information on Diagnostics of the CPU 410 as PROFIBUS DP Master
298
System Status Lists for PROFINET IO
301
Configuring with STEP 7
302
Rules for Arranging Fault-Tolerant Station Components
302
Configuring Hardware
303
Assigning Parameters to Modules in a Fault-Tolerant Station
304
Recommendations for Setting CPU Parameters, Fixed Settings
304
Networking Configuration
305
The STEP 7 User Program
306
The User Program
306
Programming Device Functions in STEP 7
308
Communication Services
308
Overview of Communication Services
308
PG Communication
310
OP Communication
310
S7 Communication
310
Munication
311
S7 Routing
312
Data Set Routing
316
SNMP Network Protocol
317
Open Communication Via Industrial Ethernet
318
Basics and Terminology of Fault-Tolerant Communication
321
Usable Networks
325
Communication Via S7 Connections
325
Communication Via S7 Connections - One-Sided Mode
326
Communication Via Redundant S7 Connections
328
Communication Via Point-To-Point CP on the ET 200M
329
Custom Connection to Single-Channel Systems
331
Communication Via Fault-Tolerant S7 Connections
332
Communication between Fault-Tolerant Systems
334
Communication between Fault-Tolerant Systems and a Fault-Tolerant CPU
337
Communication between Fault-Tolerant Systems and Pcs
338
Consistent Data
340
Consistency of Communication Blocks and Functions
340
Consistency Rules for SFB 14 "GET" or Read Variable, and SFB 15 "PUT" or Write Variable
340
Consistent Reading and Writing of Data from and to DP Standard Slaves/Io Devices
341
Link-Up and Update Sequence
343
Link-Up Sequence
346
Update Sequence
347
Switch to CPU with Modified Configuration
351
Disabling of Link-Up and Update
352
The User Program
353
Other Options for Connecting Redundant I/Os
354
CPU 410 Cycle and Reaction Times
357
Cycle Time
357
Calculating the Cycle Time
359
Cycle Load Due to Communication
362
Response Time
364
Calculating Cycle and Response Times
369
Examples of Calculating the Cycle and Response Times
370
Interrupt Response Time
373
Example of Calculation of the Interrupt Response Time
375
Reproducibility of Delay and Watchdog Interrupts
376
Runtimes of the Fcs and Fbs for Redundant I/Os
377
Characteristic Values of Redundant Automation Systems
379
Basic Concepts
379
Comparison of MTBF for Selected Configurations
383
System Configurations with Redundant CPU 410
383
System Configurations with Distributed I/Os
384
Comparison of System Configurations with Standard and Fault-Tolerant Communication
388
Function and Communication Modules that Can be Used in a Redundant Configuration
389
Connection Examples for Redundant I/Os
391
MTA Terminal Modules (Marshalled Termination Assemblies)
391
Interconnection of Output Modules
391
8-Channel HART Analog Input MTA
393
8-Channel HART Analog Output MTA
394
SM 321; DI 16 X DC 24 V, 6ES7 321-1BH02-0AA0
395
SM 321; DI 32 X DC 24 V, 6ES7 321-1BL00-0AA0
396
SM 321; DI 16 X AC 120/230V, 6ES7 321-1FH00-0AA0
397
SM 321; DI 8 X AC 120/230 V, 6ES7 321-1FF01-0AA0
398
SM 321; DI 16 X DC 24V, 6ES7 321-7BH00-0AB0
399
SM 321; DI 16 X DC 24V, 6ES7 321-7BH01-0AB0
400
SM 326; DO 10 X DC 24V/2A, 6ES7 326-2BF01-0AB0
401
SM 326; DI 8 X NAMUR, 6ES7 326-1RF00-0AB0
402
SM 326; DI 24 X DC 24 V, 6ES7 326-1BK00-0AB0
403
SM 421; DI 32 X UC 120 V, 6ES7 421-1EL00-0AA0
404
SM 421; DI 16 X DC 24 V, 6ES7 421-7BH01-0AB0
405
SM 421; DI 32 X DC 24 V, 6ES7 421-1BL00-0AB0
406
SM 421; DI 32 X DC 24 V, 6ES7 421-1BL01-0AB0
407
SM 322; DO 8 X DC 24 V/2 A, 6ES7 322-1BF01-0AA0
408
SM 322; DO 32 X DC 24 V/0,5 A, 6ES7 322-1BL00-0AA0
409
SM 322; DO 8 X AC 230 V/2 A, 6ES7 322-1FF01-0AA0
410
SM 322; DO 4 X DC 24 V/10 Ma [Eex Ib], 6ES7 322-5SD00-0AB0
411
SM 322; DO 4 X DC 15 V/20 Ma [Eex Ib], 6ES7 322-5RD00-0AB0
412
SM 322; DO 8 X DC 24 V/0.5 A, 6ES7 322-8BF00-0AB0
413
SM 322; DO 16 X DC 24 V/0.5 A, 6ES7 322-8BH01-0AB0
414
SM 332; AO 8 X 12 Bit, 6ES7 332-5HF00-0AB0
415
SM 332; AO 4 X 0/4
416
SM 422; DO 16 X AC 120/230 V/2 A, 6ES7 422-1FH00-0AA0
417
SM 422; DO 32 X DC 24 V/0.5 A, 6ES7 422-7BL00-0AB0
418
SM 331; AI 4 X 15 Bit [Eex Ib]; 6ES7 331-7RD00-0AB0
419
SM 331; AI 8 X 12 Bit, 6ES7 331-7KF02-0AB0
420
SM 331; AI 8 X 16 Bit; 6ES7 331-7NF00-0AB0
421
SM 331; AI 8 X 16 Bit; 6ES7 331-7NF10-0AB0
422
AI 6Xtc 16Bit Iso, 6ES7331-7PE10-0AB0
423
SM331; AI 8 X 0/4
424
SM 332; AO 4 X 12 Bit; 6ES7 332-5HD01-0AB0
426
SM332; AO 8 X 0/4
427
Index
429
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