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Brand | Sony |
---|---|
Model | HCD-LV80 |
Category | Stereo System |
Language | English |
Detailed electrical and input/output specifications for the amplifier.
Specifications for the video input/output signals and formats.
Technical specifications for the CD playback system and laser.
Specifications for the tape deck's recording and playback capabilities.
Tuning range, antenna specifications, and intermediate frequency for FM reception.
Tuning range and intermediate frequency for AM reception.
Guidelines for safely handling sensitive optical pick-up components during repair.
Precautions for checking laser diode emission safely and correctly.
Procedure to clear all stored data and reset the unit to initial conditions.
Procedure to move the CD pick-up to a position suitable for transport.
Mode to freely run the CD sled motor, useful for cleaning the pick-up.
Mode to test all LEDs and fluorescent indicators, and check button functions.
Identification and description of all buttons, knobs, jacks, and indicators on the front panel.
Step-by-step guide for removing the front panel and video board assembly.
Procedure for disassembling and accessing the main circuit board.
Steps to remove the sub panel, revealing internal components.
Guide for disassembling the CD lid and its related parts.
Procedure for dismantling the tape deck mechanism and cassette lid.
Test mode for checking video CD signals with color bars and audio output.
Specifications and methods for measuring torque on various mechanical parts.
Procedure for adjusting the record/playback head azimuth for optimal stereo separation.
Steps to adjust tape speed for both normal and double-speed playback.
Procedure for adjusting the record bias level for tape recording accuracy.
Procedure for checking the S-curve waveform related to focus and tracking servo performance.
Method for checking the traverse balance of the optical pick-up.
Procedure to verify the RF signal level from the CD player.
Diagram illustrating the physical placement of all circuit boards within the unit.
High-level block diagrams showing system architecture and signal flow.
Exploded view showing the main chassis, back panel, and associated hardware.
Exploded view of the front panel components, including controls and indicators.
Further exploded view of front panel parts, such as CD lid and panel assemblies.
Exploded view of the internal chassis structure and major component mounting.
Exploded view of the tape mechanism (Deck A) components.
Exploded view of the tape mechanism (Deck B) components and related parts.
Exploded view of the CD player mechanism assembly.
Exploded view of the base unit, including optical pick-up and motor.
List of electrical components used in the audio section of the main board.
List of components for the BD (Base Unit) board, including resistors, capacitors, and ICs.
Comprehensive list of components for the main board, covering various sections.
List of electrical components used in the video processing sections.
Listing of general parts, wires, fuses, and hardware used in the assembly.
A detailed list of screws, wires, and other hardware used in the product.