3 Packages
3.1 Package summary
The package selection must consider the constraints that are strongly dependent upon the application.
The list below summarizes the most frequent ones:
• Number of interfaces required: Some interfaces may not be available on some packages. Some interfaces
combinations may not be possible on some packages.
• PCB technology constrains: Small pitch and high-ball density may require more PCB layers and
higher‑
class PCB.
• Package height
• PCB available area
• Noise emission or signal integrity of high-speed interfaces
• Smaller packages usually provide better signal integrity. This is further enhanced as small-pitch and high-
ball density requires multilayer PCBs that allow better supply/ground distribution.
• Compatibility with other devices
AN5373
Packages
AN5373 - Rev 6
page 21/47
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