ME310G1 Hardware Design Guide
1VV0301588 Rev. 16 Page 71 of 95 2021-10-27
Time maintained above:
– Temperature (TL)
– Time (tL)
Time within 5°C of actual Peak
Temperature (tp)
Time 25°C to Peak Temperature
Table 44 Profile feature recommendations
Note: All temperatures refer to the topside of the package, measured
on the package body surface.
Warning: The ME310G1 modules withstand one reflow process only.
Warning: The solder reflow profile represents the typical SAC reflow
limits. It does not guarantee the proper adherence of the module to
the customer’s application throughout the temperature range. The
customer must optimize the reflow profile based on the factors such
as thermal mass and warpage.
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