ME310G1 Hardware Design Guide
1VV0301588 Rev. 16 Page 70 of 95 2021-10-27
Table 43: Solder paste
We recommend using only “no-clean” solder paste to avoid cleaning of the modules after
assembly.
10.5 Solder Reflow
Recommended solder reflow profile:
Figure 27: Recommended Solder reflow profile
Warning: The solder reflow profile represents the typical SAC reflow
limits. It does not guarantee the proper adherence of the module to
the customer’s application throughout the temperature range. The
customer must optimize the reflow profile based on the factors such
as thermal mass and warpage.
Average ramp-up rate (T
L
to T
P
)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
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