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PACKAGE OPTION ADDENDUM

www.ti.com

12-Jul-2016

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

MSP430F5526IZQER ACTIVE BGA

MICROSTAR

JUNIOR

ZQE 80 2500 Green (RoHS

& no Sb/Br)

SNAGCU Level-3-260C-168 HR -40 to 85 M430F5526

MSP430F5527IPN ACTIVE LQFP PN 80 119 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5527

MSP430F5527IPNR ACTIVE LQFP PN 80 1000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5527

MSP430F5528IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU |

CU NIPDAUAG

Level-3-260C-168 HR -40 to 85 M430F5528

MSP430F5528IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS

& no Sb/Br)

CU NIPDAU |

CU NIPDAUAG

Level-3-260C-168 HR -40 to 85 M430F5528

MSP430F5528IYFFR ACTIVE DSBGA YFF 64 2500 Green (RoHS

& no Sb/Br)

SNAGCU Level-1-260C-UNLIM -40 to 85 M430F5528

MSP430F5528IZQE ACTIVE BGA

MICROSTAR

JUNIOR

ZQE 80 360 Green (RoHS

& no Sb/Br)

SNAGCU Level-3-260C-168 HR -40 to 85 M430F5528

MSP430F5528IZQER ACTIVE BGA

MICROSTAR

JUNIOR

ZQE 80 2500 Green (RoHS

& no Sb/Br)

SNAGCU Level-3-260C-168 HR -40 to 85 M430F5528

MSP430F5529IPN ACTIVE LQFP PN 80 119 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5529

MSP430F5529IPNR ACTIVE LQFP PN 80 1000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5529

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.