Texas Instruments MSP430F5529

MSP430F5529 , MSP430F5528 , MSP430F5527 , MSP430F5526
MSP430F5525 , MSP430F5524 , MSP430F5522 , MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com SLAS590M –MARCH 2009–REVISED NOVEMBER 2015
5.6 Thermal Characteristics
PARAMETER VALUE UNIT
LQFP (PN) 70
Low-K board (JESD51-3) VQFN (RGC) 55
BGA (ZQE) 84
θ
JA
Junction-to-ambient thermal resistance, still air °C/W
LQFP (PN) 45
High-K board (JESD51-7) VQFN (RGC) 25
BGA (ZQE) 46
LQFP (PN) 12
θ
JC
Junction-to-case thermal resistance VQFN (RGC) 12 °C/W
BGA (ZQE) 30
LQFP (PN) 22
θ
JB
Junction-to-board thermal resistance VQFN (RGC) 6 °C/W
BGA (ZQE) 20
Copyright © 2009–2015, Texas Instruments Incorporated Specifications 23
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513