TYAN FT83-B7119 - Page 16

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Thermal Design
Power (TDP) Wattage
Max up to 205W
System Bus
Up to 10.4/9.6 GT/s with Intel
UltraPath Interconnect (UPI)
support
Chipset
PCH
Intel C621
Switch IC
(2) PLX PEX8796
Memory
Supported DIMM
Qty
(12)+(12) DIMM slots
DIMM Type / Speed
DDR4 RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS
2933/2666, DDR4 JEDEC NVDIMM
2666, Intel Optane DC Persistent
Memory Module (DCPMM)
Capacity
Up to 768GB RDIMM/ 1,536GB
LRDIMM/ 3,072GB RDIMM
3DS/LRDIMM 3DS *Follow latest
Intel DDR4 Memory POR
Memory channel
6 Channels per CPU
Memory voltage
1.2V
Notification
DDR4-2933 speed only supported
with 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake) and in a 1 DIMM per channel
configuration., Intel Optane DC
Persistent Memory Module
(DCPMM) only supported with
specific 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake). Please contact Tyan
Technical Support for more detail.
Expansion Slots
PCI-E
(1) PCI-E Gen3 x16 slot (FH, FL,
SW), (10) PCI-E Gen3 x16 slots (FH,
FL, DW)
Pre-install TYAN
Riser Card
(PCI-E Gen3)
(1) M2217-L16-IO # riser card for (1)
storage mezz. slot
Pre-install TYAN
Mezz. Card
(PCI-E Gen3)
(1) M7108-X550-2T LAN mezz. card
w/ (2) 10GbE ports (deployed on (1)
PCI-E Gen3 x16 OCP 2.0 slot)
Others
(1) PCI-E Gen3 x16 OCP 2.0 slot
(conn.A+conn.B), (1) PCI-E Gen3
x16 storage mezz. slot
Notification
# The item not sold separately