Agilent InfinityLab LC Series RID User Manual 180
12 Hardware Information
Instrument Layout
Instrument Layout
The industrial design of the module incorporates several innovative features. It
uses Agilent’s E-PAC concept for the packaging of electronics and mechanical
assemblies. This concept is based upon the use of expanded polypropylene
(EPP) layers of foam plastic spacers in which the mechanical and electronic
boards components of the module are placed. This pack is then housed in a
metal inner cabinet which is enclosed by a plastic external cabinet. The
advantages of this packaging technology are:
•
virtual elimination of fixing screws, bolts or ties, reducing the number of
components and increasing the speed of assembly/disassembly,
•
the plastic layers have air channels molded into them so that cooling air can
be guided exactly to the required locations,
•
the plastic layers help cushion the electronic and mechanical parts from
physical shock, and
•
the metal inner cabinet shields the internal electronics from electromagnetic
interference and also helps to reduce or eliminate radio frequency emissions
from the instrument itself.
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