Technical Manual
38
Electronics Pod Assembly
Description
The Electronics Pod is manufactured from low carbon 316-grade stainless steel
and is sealed at atmospheric pressure. There are a range of Subconn
connectors on the top cap of the pod for interconnection to the various
components of the system.
Power to the Electronics Pod is passed to the Power Supply Board that
converts the mains voltage into low voltage dc for use by the sensors and
electronic circuits. A separate low noise power supply is also located on the
Power Supply PCB that provides power for the Datem Digital Cone.
Data is passed to the Telemetry PCB inside the Electronics Pod via a co-axial
connector from the Power Pod. The data is de-coupled from the high voltage
AC supply in the Transformer Pod by the Data Coupler PCB prior to sending to
the Electronics Pod.
A Connector PCB inside the Electronics Pod provides the means of
interconnecting the Telemetry Board, the Microprocessor and the power supply
PCB as well as terminating the connections from the various sensors.
The Frame Tilt Sensor is mounted on the microprocessor board. This board
also performs the pod’s temperature and humidity sensing functions.
The general arrangement and connections of the Electronics Pod can be found
in figure 16.
To Next Page
Loading...