G3SeriesPROFIBUS‐DPTechnicalManual
Page 29
TDG3PTTM1-2EN 02/09
Subject to change without notice
www.numatics.com/g3
Distribution
Distribution of I/O capability can be easily achieved with the G3 platform by means of Sub-Bus modules. I/O
modules, valve manifolds and/or a combination of both can be simply separated from the main manifold and
distributed via a sub-bus communication cable. The G3 platform uses the same I/O modules on the main
manifold as on the distribution chain. The main communication module can control up to 16 I/O modules
either on the main manifold or as part of the sub-bus connections. To utilize the sub-bus distribution
capabilities the Sub-Bus OUT module must be located on the end of the main communication manifold and a
Terminator Module must be located at the last sub-bus component.
Example 1
Detail No. Description
1 Main Communication Module (Node)
2 Sub-Bus Power Cable (Can be connected to separate power supply for isolated power control)
3 Distributed Sub-Bus Valve Module
4 Sub-Bus IN module
5 Sub-Bus OUT module
6 Sub-Bus Communication Cable
7 I/O Modules
8 Terminator Module (Used to terminate sub-bus)
9 Aux. Power IN (Used to augment Input power and/or supply power to Output modules)
10 Aux. Power OUT (Can be used to supply power to distributed modules)
Fieldbus network
4
5
3
6
8
Distributed
Sub-Bus
I/O
Modules
1
2
Main Fieldbus
Valve
Manifold with
I/O
Distributed
Sub-Bus
Valve
Power
Supply
7
7
5
5
4
7
7
9
9
10