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FOM INDUSTRIE BLITZ - Residual Risk Areas - 2

FOM INDUSTRIE BLITZ
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19
BLITZ
G BG B
G BG B
G B
04-06
4.6 RESIDUAL RISK AREAS - 2
The BLITZ can be supplied (optional) with 1 belt for the removal of chips and offcuts created during cutting.
The belt can “discharge” into a container (Fig. 04-06).
The “discharge” area of the mobile belt, both in Fig. 04-06 and Fig. 04-07 is not exactly considered a “RESIDUAL
RISK AREA”; but the “mobile head roller table” may also come within this area (see residual risk areas - 1)
and so it is advisable to adopt certain measures described in the paragraph “RESIDUAL RISK AREAS -
CONCLUSIONS”.
In any case, the chips removal belt is only in motion during the cutting phase, when both cutting buttons are
pressed and up to roughly 5 seconds after the bi-manual control has been released, to allow the swarf to be
evacuated from around the head.
WARNING
Clean away the swarf only once the belt has stopped.

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