Chapter 2: Choose Proper Parts For Your System
A26361-D1691-Z120-1-7619, Edition 1 9
2.2 - Memory Considerations
● Memory Type
Thunder i7525 S2676 board supports up to four 240-pin 1.8-Volt DDR-II 400 Registered ECC
DIMM modules. The DDR2-400 memory modules can be using 256Mb, 512Mb and 1Mb
memory chips.
DDR-I or Unbuffered DDR memory modules are not supported by Thunder i7525 S2676
design.
Visit Tyan’s web site for the memory recommendation list.
● Memory Installation
Thunder i7525 S2676 is based on Intel’s E7525 Tumwater chipset, which supports 144-bit
wide dual memory channels in memory interleaved scheme. System requires minimum two
memory modules, as a pair, to boot up the system.
You must install two memory modules at a time, as a pair, stating from DDR2-DIMM1 and
DDR2-DIMM2 (marked as MMX1 and MMX2, respectively). Each memory module in a pair
must be in the same capacity, speed, and configuration.
2.3 - Chassis/Enclosure Considerations
● Motherboard size
Thunder i7525 S2676 board is in the board size of 12” (W) x13” (L).
● Motherboard and CPU Heat-sink Mounting Holes
There are six motherboard-mounting holes and eight CPU heat-sink mounting holes on
Thunder i7525 S2676 board design. The motherboard and CPU mounting hole locations follow
SSI EEB v3.51 (A Server System Infrastructure specification for Entry Pedestal Servers and
Workstations) specifications. Ensure that your chassis supports those 6 motherboard-
mounting holes to secure the motherboard.
Thunder i7525 S2676 supports Intel’s CEK (Common Enabling Kit) for securing Intel’s Xeon
800 MHz FSB processors in the chassis. Two CEK springs for the dual processors are pre-
assembled with the motherboard or enclosed in the motherboard accessory package. The
CPU heat-sinks must be mounted down to the chassis base pan with stand-offs. Any
additional chassis standoffs, besides the 6 motherboard-mounting holes and 8 CPU heat-sink
mounting holes, should be removed to preventing from short-circuit or motherboard damage.
● Others
As a system integrator, the air-flow/thermal, EMI/EMC, shock/vibration, and system packing
should be also considered for choosing a proper enclosure.
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