Thermal solution
Description Spare part number
Thermal solution (includes replacement thermal material and Mylar screw/POGO cover) L14783-001
Before removing the thermal solution, follow these steps:
1. Turn o the tablet. If you are unsure whether the tablet is o or in Hibernation, turn the tablet on,
and then shut it down through the operating system.
2. Disconnect the power from the tablet by rst unplugging the power cord from the AC outlet, and then
unplugging the AC adapter from the tablet.
3. Disconnect all external devices from the tablet.
4. Remove the display panel assembly (see Display assembly on page 32).
5. Remove the Mylar shield (see Mylar shield (WWAN models only) on page 37).
Remove the thermal solution:
1. Remove three Mylar pieces from the thermal solution (1).
2. Remove the six Phillips M2.0×2.0 screws (2) that secure the thermal solution to the system board.
3. Starting from bottom left, lift thermal solution from the tablet to remove it (3).
NOTE: The thermal paste near the bottom, left of the thermal solution can stick to the system board.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the thermal solution is removed. Replacement thermal material is included with
the thermal solution and system board spare part kits.
Thermal paste is used on the processor (1) and the heat sink (2) that services it.
38 Chapter 5 Removal and replacement procedures for Authorized Service Provider parts
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