Need help?Do you have a question about the Intel Quad-Core Xeon and is the answer not in the manual?
General| Number of Cores | 4 |
|---|---|
| Threads per Core | 1 |
| Virtualization Technology | Intel VT-x |
| Instruction Set | x86-64 |
| Instruction Set Extensions | SSE4.2 |
Defines key terms and acronyms used throughout the datasheet for clarity.
Confirms data accuracy is limited to the publication date of the document.
Lists related documents providing additional information on the processor.
Details the Front Side Bus signaling technology and reference voltage levels.
Specifies the VCC, VSS, and VTT land requirements for power delivery.
Provides essential guidelines for VCC and VTT decoupling for system stability.
Explains the role of BCLK and PLL in controlling processor frequency.
Details the VID signals for automatic processor voltage selection.
Provides guidelines for handling and connecting reserved or unused signals.
Organizes FSB signals into functional groups for easier reference.
Lists critical voltage and temperature limits for processor operation and reliability.
Defines the processor's detailed DC electrical parameters and characteristics.
Specifies allowable transient overshoot events for the VCC voltage.
Defines specifications for AGTL+ signaling on the Front Side Bus.
Defines physical keepout zones on the processor substrate for thermal solutions.
Details static and dynamic load limits for processor package assembly.
Provides guidelines for safely handling the processor package.
Specifies the number of insertion/removal cycles supported for the LGA771 socket.
States the typical mass of the Quad-Core Intel Xeon Processor 5300 Series.
Lists the materials used for key processor package components.
Illustrates topside markings for processor identification and traceability.
Shows top and bottom views of processor land coordinates for pin reference.
Provides a comprehensive list of processor pin assignments by name and number.
Provides detailed descriptions for all processor signals and their functions.
Details thermal requirements for maintaining processor operating limits.
Explains thermal management features like Thermal Monitors and TCC for temperature control.
Describes the PECI interface for thermal monitoring and control.
Lists hardware configuration options set during power-on for processor setup.
Details low power states (HALT, Extended HALT) for power consumption reduction.
Explains the technology for dynamic voltage and frequency scaling.
Introduces the specifications for Intel boxed processors and their thermal solutions.
Details the mechanical aspects of boxed processor heat sinks and retention mechanisms.
Specifies electrical requirements for active cooling solutions, including fan power.
Discusses cooling design considerations for boxed processors and system integration.
Outlines requirements for the processor debug port and associated tools.
Provides guidelines for implementing the debug port in the target system.
Describes logic analyzer interfaces for system debugging and signal analysis.
To Next Page