Quad-Core Intel® Xeon® Processor 5300 Series Datasheet 93
Thermal Specifications
Table 6-6. Quad-Core Intel® Xeon® Processor X5365 Series Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.
2. Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is
measured at maximum T
CASE
.
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
4. These specifications are based on silicon characterization.
5. Power specifications are defined at all VIDs found in Table 2-3. The Quad-Core Intel® Xeon® Processor
L5300 Series may be shipped under multiple VIDs for each frequency.
6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
7.
8.
Notes:
1. Please refer to Table 6-7 for discrete points that constitute the thermal profile.
2. Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
3.
4.
5.
Core
Frequency
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 180 150 5 See Figure 6-3;
Table 6-7
1, 2, 3, 4, 5, 6
Figure 6-3. Quad-Core Intel® Xeon® Processor X5365 Series Thermal Profile
35
40
45
50
55
60
65
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Power [W]
Tcase [C]
Thermal Profile
Y = 0.187*x + 35.0
35
40
45
50
55
60
65
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Power [W]
Tcase [C]
Thermal Profile
Y = 0.187*x + 35.0
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